Preparation method of split type window CMP polishing pad and CMP polishing pad

A polishing pad and split-type technology, applied in the field of polishing pads, can solve problems such as high scrap rate, uneven temperature, fluctuation of tensile strength of substrate, etc., and achieve the effect of reducing scrap rate and fluctuation of tensile strength

Inactive Publication Date: 2018-11-16
CHENGDU TIMES LIVE SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems that the temperature of the base material formed by the integrated window of slices is uneven during curing, which leads to fluctuations in the tensile strength of the base material, and the density is uneven after curing, and the scrap rate is high. The present invention provides a Preparation method of split window CMP polishing pad and CMP polishing pad

Method used

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  • Preparation method of split type window CMP polishing pad and CMP polishing pad
  • Preparation method of split type window CMP polishing pad and CMP polishing pad
  • Preparation method of split type window CMP polishing pad and CMP polishing pad

Examples

Experimental program
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Effect test

Embodiment 1

[0037] A method for preparing a split window CMP polishing pad, comprising the following steps:

[0038] (1) Take the base material 1 and carve the groove 6 on the base material 1;

[0039] (2) Take the substrate 4 and stick a layer of back glue B 9 on the bottom of the substrate 4;

[0040] (3) engraving a window hole 2 for placing the window material 8 on the substrate 1 of the engraving groove 6;

[0041] (4) Bond the substrate 1 engraved with the window hole 2 and the substrate 4 with the back glue B 9 through the back glue A3, and then use the substrate stamping die to place the substrate 4 at the window hole 2 position of the substrate 1 A substrate hole 5 is punched out, and two window support blocks 7 are formed on both sides of the bottom of the window hole 2;

[0042] (5) Another window material is taken and the window material is stamped with a punching machine and a window material stamping die to obtain a formed window material 8;

[0043] (6) smear one deck pr...

Embodiment 2

[0054] A method for preparing a split window CMP polishing pad, comprising the following steps:

[0055] (1) Take the base material 1 and carve the groove 6 on the base material 1;

[0056] (2) Take the substrate 4 and stick a layer of back glue B 9 on the bottom of the substrate 4;

[0057] (3) engraving a window hole 2 for placing the window material 8 on the substrate 1 of the engraving groove 6;

[0058](4) Bond the base material 1 engraved with the window hole 2 and the substrate 4 with the back glue B 9 pasted through the back glue A 3, and then use the substrate stamping die to place the substrate at the position of the window hole 2 of the base material 1. 4 punch out a substrate hole 5, and form two window support blocks 7 on both sides of the bottom of the window hole 2;

[0059] (5) Another window material is taken and the window material is stamped with a punching machine and a window material stamping die to obtain a formed window material 8;

[0060] (6) smear...

Embodiment 3

[0071] A method for preparing a split window CMP polishing pad, comprising the following steps:

[0072] (1) Take the base material 1 and carve the groove 6 on the base material 1;

[0073] (2) Take the substrate 4 and stick a layer of back glue B 9 on the bottom of the substrate 4;

[0074] (3) engraving a window hole 2 for placing the window material 8 on the substrate 1 of the engraving groove 6;

[0075] (4) Bond the base material 1 engraved with the window hole 2 and the substrate 4 with the back glue B 9 pasted through the back glue A 3, and then use the substrate stamping die to place the substrate at the position of the window hole 2 of the base material 1. 4 punch out a substrate hole 5, and form two window support blocks 7 on both sides of the bottom of the window hole 2;

[0076] (5) Another window material is taken and the window material is stamped with a punching machine and a window material stamping die to obtain a formed window material 8;

[0077] (6) smea...

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Abstract

The invention discloses a preparation method of the split type window CMP polishing pad. The preparation method comprises the following steps that a base material is engraved with a groove and a window hole for containing a window material; then then the base material and a pad are attached through back glue; a pad punching die is used to produce a pad hole on the pad through punching in the position of the window hole of the base material, and window supporting blocks are formed at the same time; then a punching machine and a window material punching die are used for punching the window material, so that a molded window material is obtained; then each window supporting block is coated with a layer of bottom coating agent; and finally, the molded window material is placed in the hole position of the window and attached to the window supporting blocks, and a CMP polishing pad is prepared by using the method. Compared with a slicing integrated window, through the mode of the later-stagewindow fitting, the materials do not influence each other in the manufacturing process, the problem that the density distribution of the solidified base material is not uniform can be solved, so thatthe fluctuation of the tensile strength due to uneven temperature can be reduced, the rejection rate of the base material can be effectively reduced, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of polishing pads, in particular to a method for preparing a split window CMP polishing pad and the CMP polishing pad. Background technique [0002] CMP, namely Chemical Mechanical Polishing, chemical mechanical polishing. The basic principle of CMP is: the rotating polished wafer is pressed on the elastic polishing pad rotating in the same direction, and the polishing slurry flows continuously between the wafer and the base plate. The upper and lower discs rotate in reverse at high speed, the reaction products on the surface of the polished wafer are continuously stripped, new polishing slurry is added, and the reaction products are taken away with the polishing slurry. A chemical reaction occurs on the newly exposed wafer plane, and the product is peeled off again and the cycle is repeated. Under the joint action of the substrate, abrasive grains and chemical reagents, an ultra-fine surface is formed. As a consuma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/26
Inventor 宋思琪
Owner CHENGDU TIMES LIVE SCI & TECH
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