Image processing based cable semi-conductive layer automatic detection method

Abstract

The invention discloses an image processing based insulating sheet semi-conductive layer automatic detection method, which can achieve automatic detection of an insulating sheet semi-conductive layerof a cable. The method includes: acquiring a cable insulation sheet test piece image; performing image preprocessing; extracting a region of interest; segmenting the region of interest, screening a segmented connected domain set, and generating a semi-conductive layer profile; and performing defect detection and compensation on the generated semi-conductive layer profile. The insulating sheet semi-conductive layer automatic detecting method has high detection efficiency and high precision, fully considers factors such as knife marks and illumination, and greatly reduces the working load of thetesting personnel.

Description

technical field [0001] The invention belongs to the technical field of precision measurement, in particular to an image processing-based automatic detection method for cable semiconducting layers. Background technique [0002] At present, the method of measuring parameters such as the thickness, area and eccentricity (or eccentricity) of the cable semiconducting layer is manual measurement. For example, to measure the thickness and eccentricity of the semiconducting layer at present, it is generally to use a measuring projector to enlarge the cable test piece to a certain magnification and project it on the screen through optical projection, and then read the coordinates of different positions by manually moving the coordinate bracket. Calculate the thickness value, and then calculate the eccentricity. [0003] However, the following problems will arise when using traditional devices and measurement methods to measure the thickness of the cable semiconducting layer: [000...

AI Technical Summary

Problems solved by technology

[0004] 1. Manual measurement is complicated, and the measurement error caused by human factors is relatively large. It is necessary to manually estimate the position of the center of the circle and select the measurement point of the test piece

[0005] 2. Manual calculation is complex, with many calculation items and a large amount of calculation, which is prone to calculation errors

[0006] 3. Corresponding measuring tools are required for measurement. When measuring some test pieces, a reading microscope or a projector with a magnification of at least 10 times is often required as a measuring device. The operation is complicated, takes a long time, and requires high requirements for testers.

[0007] The existing device for detecting the thickness of the semiconducting layer requires the measurement personnel to manually determine the center of the circle, and rotate the test piece to determine the thinnest point and other N test points. Manual measurement is complicated, time-consuming, and easily causes errors.

In addition, although there is already a cable insulation layer thickness detection device based on image processing, the existing device can only detect the thickness of the insulation layer, insulation shielding layer and other layers. Due to the particularity of the semiconductive layer structure, the existing method cannot Meet the demand for inspection of semiconducting layers

Images