Multilayer ceramic capacitor and preparation method thereof

A multi-layer ceramic and capacitor technology, applied in the direction of multilayer capacitors, fixed capacitor electrodes, fixed capacitor dielectrics, etc., can solve the problems of incomplete removal of adhesives, decreased density and uniformity of ceramic bodies, etc., to achieve good consistency , good density and good dielectric properties

Active Publication Date: 2018-11-20
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the debonding is carried out on the larger volume of the third substrate, there is a problem that the binder co

Method used

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  • Multilayer ceramic capacitor and preparation method thereof
  • Multilayer ceramic capacitor and preparation method thereof
  • Multilayer ceramic capacitor and preparation method thereof

Examples

Experimental program
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Effect test

no. 1 approach

[0060] An embodiment of the multilayer ceramic capacitor of the present invention, combined with figure 1 , the multilayer ceramic capacitor described in this embodiment is prepared by the following method:

[0061] Step 1: Mix ceramic powder doped with sintering aid, binder, and organic solvent uniformly to obtain a ceramic slurry, and then use the ceramic slurry as a raw material to prepare a ceramic film.

[0062] In this embodiment, the operation of uniformly mixing the ceramic powder doped with sintering aid, the binder, and the organic solvent is as follows: the ceramic powder doped with the sintering aid, the adhesive, and the organic solvent are uniformly mixed by ball milling , The ball milling time can be 10h ~ 16h.

[0063] In the ceramic slurry, the mass ratio of the ceramic powder doped with the sintering aid, the binder and the organic solvent is 10:(3-5):(6-9).

[0064] In this embodiment, in the ceramic powder doped with the sintering aid, the mass percentage...

no. 2 approach

[0106] An embodiment of the multilayer ceramic capacitor of the present invention, the multilayer ceramic capacitor described in this embodiment is prepared by the following method:

[0107] Steps 1 to 5 are the same as those in the first embodiment.

[0108] Step 6: Laminate the zirconia film to obtain the second laminated unit, then laminate a plurality of ceramic films on the opposite sides of the second laminated unit to obtain the third laminated unit, and then respectively laminate the two opposite sides of the third laminated unit Zirconia films were laminated to obtain a second substrate.

[0109] Step 7: Pressing the second substrate and cutting it to obtain a green body.

[0110] Step 7 may specifically be: pressing the second substrate together by isostatic pressing to closely bond the film layers in the second substrate; then cutting the second substrate vertically and horizontally according to a predetermined size to obtain multiple green blocks.

[0111] The gr...

no. 3 approach

[0120] An embodiment of the multilayer ceramic capacitor of the present invention, the multilayer ceramic capacitor described in this embodiment is prepared by the following method:

[0121] Steps 1 to 5 are the same as those in the first embodiment.

[0122] Step 6: Print nickel paste on the ceramic film obtained in step 1 to form an additional layer, laminate the ceramic film printed with the additional layer to obtain a second laminate unit, and then laminate zirconia on the two opposite sides of the second laminate unit film to obtain a second substrate.

[0123] In the operation of printing nickel paste on the ceramic film to form an additional layer, the screen printing process is selected for printing. The thickness of the additional layer may be 2-5 μm.

[0124] Generally, the second lamination unit can be obtained by laminating 4 to 38 ceramic films printed with additional layers, and the number of zirconia films laminated on two opposite sides of the second laminat...

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Abstract

The invention discloses a preparation method of a multilayer ceramic capacitor. According to the preparation method, a sintered block and a laminated body are mixed together and placed on a bearing-sintering plate, and then the laminated body is sintered; sintering aids in the sintered block are volatilized, so that a local atmosphere with relatively high volatilization concentration is formed around the laminated body, excessive volatilization of the sintering aids in the laminated body can be prevented, and the ceramic body obtained after sintering is uniform and compact, and high in the consistency; the sintered block is prepared through a pressing step, so that the density is relatively high, and enough local atmosphere can be provided for the laminated body during sintering; the foursurfaces of the sintered block have inwards recessed areas, so that when the sintered block and the laminated body are mixed together, the four surfaces of the sintered block and the laminated body are difficult to form relatively large area contact; and the other two surfaces of the sintered block are flat surfaces and are made of zirconium oxide, so that relatively large area contact with the laminated body can be formed; and zirconium oxide is high in chemical stability, and does not react with and is not bonded with the laminated body in the sintering process of the laminated body.

Description

technical field [0001] The invention relates to a capacitor and a preparation method thereof, in particular to a multilayer ceramic capacitor and a preparation method thereof. Background technique [0002] The preparation of multilayer ceramic capacitors with copper inner electrodes requires the use of low-temperature sintered ceramic materials in order to co-fire with copper inner electrodes. Sintered dense. Since the sintering aid components tend to volatilize easily during high-temperature sintering, it is easy to cause the problem of deterioration of the consistency of the ceramic chips loaded on the same setter. Specifically, when the ceramic chips loaded on the same setter are sintered at high temperature, the ceramic chips with a higher loading density can hinder the volatilization due to the higher concentration of the volatile atmosphere of the firing aid components, so more of the firing aid components remain. The formation of a liquid phase in the ceramic chip p...

Claims

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Application Information

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IPC IPC(8): H01G4/005H01G4/12H01G4/224H01G4/232H01G4/30
CPCH01G4/005H01G4/12H01G4/224H01G4/232H01G4/30
Inventor 陆亨冯小玲武垦生廖庆文安可荣唐浩宋子峰
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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