Reflow furnace temperature zone division method, device and computer-readable storage medium
A reflow furnace and temperature zone technology, which is applied in the direction of assembling printed circuits, printed circuits, and electrical components with electrical components, and can solve the problems of temperature curve analysis without reflow furnaces.
Inactive Publication Date: 2019-12-17
GREE ELECTRIC APPLIANCES INC
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[0003] The main purpose of the present invention is to overcome the defects of the above-mentioned prior art, and provide a reflow furnace temperature zone division method, device and computer-readable storage medium to solve the problem of not analyzing the temperature curve in the reflow furnace well in the prior art The problem
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[0031] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embo...
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The invention provides a reflow furnace temperature zone partitioning method and device as well as a computer readable storage medium. The method comprises the following steps: acquiring air temperatures in a reflow furnace and board test temperatures of a to-be-welded PCB in a reflow welding process; obtaining an air temperature variation curve of the reflow furnace according to the air temperatures, and obtaining a board test temperature variation curve of the PCB according to the board test temperatures; determining temperature zone anchor points of the reflow furnace according to the air temperature variation curve and the board test temperature variation curve, wherein the temperature zone anchor points are taken as demarcation points of a heating zone and a cooling zone of the reflowfurnace; and performing temperature zone partitioning on the heating zone of the reflow furnace according to the air temperature variation curve and the temperature zone anchor points. The scheme provided by the invention can precisely obtain temperature zone partitions, specific to an air temperature curve over time of the reflow furnace and a board test temperature curve over time, of the heating zone of the reflow furnace and then obtain temperature conditions of each temperature zone of the heating zone.
Description
technical field [0001] The present invention relates to the technical field of reflow soldering, in particular to a method and device for dividing the temperature zones of a reflow furnace and a computer-readable storage medium. Background technique [0002] Reflow soldering is the core technology of the current surface mount (SMT) production process, and the soldering temperature is a key factor that directly determines the quality of reflow soldering. Among them, the setting of the temperature curve is the most important, which directly determines the quality of reflow soldering. It is very important to control and analyze the temperature and temperature curve in the furnace, but there is no good solution for analyzing the temperature curve in the reflow furnace in the prior art. Contents of the invention [0003] The main purpose of the present invention is to overcome the defects of the above-mentioned prior art, and provide a reflow furnace temperature zone division m...
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IPC IPC(8): H05K3/34
CPCH05K3/3494H05K2203/04
Inventor 陈友桂龙作谦崔耿贤蔡小洪闫红庆王文斌钟明生钟雄斌余玮张显伟汪乔王强
Owner GREE ELECTRIC APPLIANCES INC