Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Die cutting method for adhesive product

A technology for sticking products and products, which is applied in the field of die-cutting of glued products, can solve the problems of user waste and increase production costs, and achieve the effect of reducing enterprise costs and improving material utilization

Inactive Publication Date: 2018-11-23
SUZHOU TIANLIDA ADHESIVE PROD CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing die-cutting technology processes adhesive products, it mainly uses die-cutting technology to die-cut the entire adhesive product according to the actual required shape. In the actual use process, the die-cut structure of the adhesive product Various, many of which are special-shaped structures, the existing die-cutting method will leave a lot of blanks on the adhesive products due to technical problems, these blanks have brought a certain amount of waste to users, and also increased the cost of production cost, in view of the above problems, the industry needs a new die-cutting method for adhesive products to solve the problems faced by the industry

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Die cutting method for adhesive product
  • Die cutting method for adhesive product
  • Die cutting method for adhesive product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention is described in detail below in conjunction with accompanying drawing and specific embodiment: According to Figure 1 to Figure 3 A die-cutting method of an adhesive product shown is provided with an adhesive product 1 and a punch press for die-cutting the adhesive product 1, and a mold is also arranged on the punch press, and the adhesive product 1 is formed by a bottom Die, adhesive layer, and upper die, the die-cutting steps are as follows:

[0019] (1), the mold is fixed on the punch, and then the adhesive product 1 is placed on the mold;

[0020] (2), start the punching machine, first be provided with a plurality of auxiliary positioning holes 2 on the base mold of the adhesive product 1 by the punching machine and the mold;

[0021] (3) Then, the adhesive product 1 can be punched several times according to the auxiliary positioning hole 2 .

[0022] In order to increase the punching effect, further, the punching machine is a four-column pun...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a die cutting method for an adhesive product and belongs to the technical field of material processing. An adhesive product is arranged, and a punching machine used for implementing die cutting on the adhesive product is arranged; the punching machine is further provided with a mold; the adhesive product consists of a bottom die, an adhesive layer and an upper die; the diecutting method comprises the following steps of: fixing the mold to the punching machine; subsequently placing the adhesive product on the mold; starting the punching machine; forming a plurality ofauxiliary positioning holes in the bottom die of the adhesive product by virtue of the punching machine and the mold; and then carrying out a plurality of times of die cutting on the adhesive productaccording to the auxiliary positioning holes. The die cutting method provided by the invention has the beneficial effects that the adhesive product is provided with a plurality of auxiliary positioning holes so that the adhesive product is subjected to a plurality of times of die cutting and punching, thus the material utilization rate of the adhesive product is increased, and the enterprise costis lowered.

Description

Technical field: [0001] The invention relates to a die-cutting method for adhesive products, belonging to the technical field of material processing. Background technique: [0002] Die-cutting products are widely used in automobile manufacturing and electronics industry. With the rapid development of technology, the die-cutting process has gradually expanded from the traditional die-cutting of printed matter to the production of auxiliary materials for electronic products. Electronic product bonding, insulation materials, dustproof, shockproof, insulation, shielding adhesive products and film products. [0003] When the existing die-cutting technology processes adhesive products, it mainly uses die-cutting technology to die-cut the entire adhesive product according to the actual required shape. In the actual use process, the die-cut structure of the adhesive product Various, many of which are special-shaped structures, the existing die-cutting method will leave a lot of bla...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/38
CPCB26F1/38
Inventor 沈为明杨程徐金飞
Owner SUZHOU TIANLIDA ADHESIVE PROD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products