A device for measuring contact thermal conductance of a solid surface joint part

Abstract

The invention relates to the technical field of contact thermal conductance measurement, and discloses a device for measuring contact thermal conductance of a solid surface joint part. The device is characterized in that the device includes: an electrical heater and a cooling plate which are opposite with each other and between which test pieces to be tested can be loaded; a loading mechanism acting on the electrical heater and / or cooling plate to tightly clamp the test pieces to be tested; a temperature sensor used for measuring the temperature of each test piece to be tested; and a heat flowmeter used for measuring the heat flux between the test pieces to be tested. A measurement result of the device is more accurate, and the device can be applied for measuring contact thermal conductance of solid surface joint parts under different environment pressures, different contact stresses and different temperature differences for components with different materials, different processing processes and different surface roughness.

Description

technical field [0001] The invention relates to the technical field of contact thermal conductivity measurement, in particular to a contact thermal conductivity measurement device. Background technique [0002] The surface of the component is not absolutely smooth. It is usually assumed that any rough surface is composed of a large number of asperities with different scales. The contact between the two surfaces occurs at a limited number of discrete contact points with high vertical height. Therefore, when the heat flow passes through the contact interface Shrinkage occurs at the discrete micro-contact points, and the thermal conductivity of the interstitial medium (usually lubricating oil or air) is generally much smaller than that of the matrix, so that the heat flow through the joint is strongly hindered, and eventually the joint surface There will be a sharp drop in temperature on both sides. The resistance received by the heat flow through the solid joint is defined as...

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Problems solved by technology

[0004] Existing measurement devices for contact heat conduction generally have certain limitations: the heat generated by the heating device is directly equated with the heat flow passing between the test pieces, ignoring the consumption of the heat flow when it is transferred on the test piece; the temperature sensor is arranged in the Both sides of the contact interface of the component, but there is a certain distance from the contact interface, resulting in inaccurate measurement results; the whole set of devices is directly placed in an atmospheric pressure environment, and cannot measure the thermal characteristic changes caused by heat convection under different ambient pressures

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