Chip alignment mounting device and method

Abstract

The present invention provides a chip alignment mounting device. The chip alignment mounting device comprises a feed mechanism, a substrate carrying mechanism, a chip supply mechanism, a chip turnovermechanism and a chip bonding mechanism, the feed mechanism is configured to provide a substrate without mounting a chip and remove a substrate with a mounted chip; the substrate carrying mechanism isconfigured to load and fix the substrate and drive the substrate to move on a first plane; the chip supply mechanism is configured to provide the chip at the chip supply position on the chip supply mechanism; the chip supply mechanism can pick up the chip from the chip supply position, transmit the chip to a chip handover position through rotation motion and supply the chip to the chip bonding mechanism; the chip bonding mechanism is configured to pick up the chip from the chip handover position and mount the chip to a pre-determined mounting position through rotation motion; and the mountingoperation position, the chip supply position and the chip handover position are fixed positions. The present invention further provides a chip alignment mounting method. The chip mounting efficiencyand precision can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a chip alignment and placement device and method thereof. Background technique [0002] With the continuous development of modern information technology and consumer electronics products, integrated circuit chips are increasingly developing in the direction of high density, high performance, light weight and short size. Chips manufactured using traditional packaging and interconnection technologies such as TO, DIP, PLCC, and QFP have been difficult to meet the increasing performance requirements of chips. Therefore, semiconductor packaging and assembly technologies such as flip-chip, fan-out packaging, and three-dimensional packaging Integrated advanced packaging technology emerged as the times require to reduce device package size, increase interconnection density, improve integrated circuit chip performance, and reduce product prices. [0003] The existi...

AI Technical Summary

Problems solved by technology

[0005] One of the defects of this type of chip mounting device and method is that the chip bonding mechanism performs translational motion. In the process of returning to the chip supply mechanism from the chip position and the chip placement work area, at least two acceleration movements and two deceleration movements are required. Frequent position movement and speed addition and subtraction are not conducive to shortening the chip placement time and controlling the chip placement the accuracy of

In addition, the second defect of this type of chip mounting device and method is that in a chip mounting cycle, the chip bonding mechanism picks up the chip from the chip supply mechanism, the chip bonding mechanism transports the chip to the predetermined placement position, and the visual imaging The process of imaging and aligning the chip by the mechanism, and mounting the chip on the predetermined placement position by the chip bonding mechanism are all carried out serially, that is, the next process can only be carried out after completing the previous process, which makes the process sequence of chip mounting Single and fixed, further increasing the total time required for die attach

[0006] Therefore, in order to simultaneously improve the placement accuracy and production efficiency of semiconductor chips on the substrate, it is urgent to propose a new chip alignment and placement device and its method, so as to solve the problem that existing equipment and methods cannot quickly complete the alignment of chips and substrates. Technical issues of standard and mounting

Images