Tilted semiconductor thermoelectric module using thermoelectric arms with octahedral structures

Abstract

The invention relates to a tilted semiconductor thermoelectric module using thermoelectric arms with octahedral structures. The module comprises two thermoelectric arms with octahedral structures, copper conductive sheets and an insulating layer, wherein the two thermoelectric arms with the octahedral structures are parallel or symmetrical and are arranged between the two copper conductive sheetsin a parallel connection mode, and the insulating layer is disposed outside the two copper conductive sheets. The two thermoelectric arms with the octahedral structures are obtained by removing cornerregions at two ends of long diagonal lines from a tilted parallelepiped thermoelectric arm, and the copper conductive sheets are added to the positions of removed parts. A tilted polyhedral structurethermoelectric arm of the invention can be applied to a module of a special structure thermoelectric power generation system, such as a double-spiral structure and a tilted multi-layer plate type structure. According to the tilted structure, the whole system has higher mechanical stability and structural adaptation and a better heat transfer characteristic.

Description

technical field [0001] The invention relates to a semiconductor thermoelectric module, in particular to an inclined semiconductor thermoelectric module adopting an octahedral thermoelectric arm. Background technique [0002] At present, the Π-type thermoelectric module is the most common module form, but in some thermoelectric power generation systems with special structures, such as double helix structure, inclined multi-layer plate structure, etc., the use of inclined thermoelectric modules can make the whole system have higher mechanical efficiency. Stability, structural adaptability and better heat transfer characteristics. [0003] Due to the inclined characteristics of the traditional inclined parallelepiped structure thermoelectric arm, the heat flux distribution is uneven during the heat transfer process, and the generated current is unevenly distributed due to the large difference in the transmission path during the transfer of the thermoelectric arm. . The voltag...

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Problems solved by technology

[0003] Due to the inclined characteristics of the traditional inclined parallelepiped structure thermoelectric arm, the heat flux distribution is uneven during the heat transfer process, and the generated current is unevenly distributed due to the large difference in the transmission path during the transfer of the thermoelectric arm.

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