Multifunctional automatic applicator of fluorescent powder glue and control method thereof

Abstract

The invention discloses a multifunctional automatic applicator of fluorescent powder glue and a control method thereof. The multifunctional automatic applicator of fluorescent powder glue comprises aframe, an upper computer, a lower computer mechanism, and a feeding conveyer belt, an application conveyer belt and a discharging conveyer belt which are connected in sequence. The lower computer mechanism includes a fluorescent powder glue feeding mechanism, a full-automatic adjustable feeding-discharging mechanism, a fluorescent powder glue micro-application mechanism, a fluorescent powder gluethickness measuring system, an electric heating pre-baking mechanism and an automatic cleaning mechanism. The multifunctional automatic applicator of fluorescent powder glue and the control method thereof can provide high-precision control for fluorescent powder glue application thickness; the problem is effectively solved that WLP-LED or CSP-LED modules have difficulty in intelligent micro application of fluorescent powder under high speed and high uniformity.

Description

technical field [0001] The invention relates to the field of LED fluorescent powder coating, in particular to a multifunctional fluorescent powder glue automatic coating machine and a control method. Background technique [0002] LED is a new type of semiconductor all-solid-state lighting source. Compared with traditional lighting technology, this new type of light source has obvious advantages such as high efficiency and energy saving, long life, small size, green environmental protection, and safe use, and is recognized as the first choice for future lighting sources. Wafer-level LED packaging technology is the future development trend, which can not only save costs, but also improve product performance. As the size of the wafer becomes larger and larger, it gradually develops from 2 inches to 4 inches, 6 inches, or even 8 inches, etc., requiring different packaging forms in the process, and wafer-level and chip-level LEDs Packaging technology can meet this diverse deman...

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Problems solved by technology

[0004] In order to overcome the problems of uneven coating thickness, low light extraction efficiency and low degree of production automation of wafer-level LEDs in the prior art, the present invention provides a multifunctional fluorescent powder glue automatic coating machine and control method, which are suitable for WLP- LED or CSP-LED module

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