Heat dissipation structure, house and electronic device

A technology of heat dissipation structure and electronic equipment, which is applied in the construction parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., which can solve the problems of poor heat dissipation of electronic equipment and unfavorable heat dissipation efficiency of electronic equipment, so as to improve heat dissipation efficiency , to avoid the effect of local high temperature

Active Publication Date: 2018-12-11
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Abstract
  • Description
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Problems solved by technology

[0002] At present, most of the heat generated by the heat source in the electronic equipment is conducted through the heat sink installed in the equipment. The heat sink is made of a single material with heat transfer performance; therefore, the heat sink can only be passively conducted from The heat at the heat source is not conducive to improving the heat dissipation efficiency of electronic equipment, which may cause poor heat dissipation of electronic equipment

Method used

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  • Heat dissipation structure, house and electronic device
  • Heat dissipation structure, house and electronic device
  • Heat dissipation structure, house and electronic device

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[0040] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

[0041] The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term...

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Abstract

The present disclosure relates to a heat dissipation structure, a housing and an electronic device. The heat dissipation structure includes a heat absorbing layer disposed close to a heat source for absorbing heat generated by the heat source. A heat conductive layer stacked and arranged with the heat absorbing layer for conducting heat absorbed by the heat absorbing layer to dissipate heat from the heat source; The heat dissipation structure proposed in the present disclosure can actively absorb heat at the heat source through the heat absorbing layer and disperse and cool the absorbed heat through the heat conducting layer, thereby avoiding local high temperature and contributing to improving heat dissipation efficiency at the heat source.

Description

technical field [0001] The present disclosure relates to the technical field of terminals, and in particular to a heat dissipation structure, a housing and electronic equipment. Background technique [0002] At present, most of the heat generated by the heat source in the electronic equipment is conducted through the heat sink installed in the equipment. The heat sink is made of a single material with heat transfer performance; therefore, the heat sink can only be passively conducted from The heat at the heat source is not conducive to improving the heat dissipation efficiency of the electronic equipment, and may cause poor heat dissipation of the electronic equipment. Contents of the invention [0003] The disclosure provides a heat dissipation structure, a casing and an electronic device to solve the deficiencies in the related art. [0004] According to a first aspect of an embodiment of the present disclosure, there is provided a heat dissipation structure, comprising...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20472H05K7/20481
Inventor 姜国刚
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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