Copper clad laminates, printed circuit boards and electronic device

A technology for printed circuit boards and electronic equipment, used in printed circuit components, circuit thermal devices, etc., can solve the problems of increased heat dissipation path path, large heat dissipation path thermal resistance, unfavorable heat dissipation, etc., to shorten the path and avoid local high temperature. , The effect of improving heat dissipation efficiency

Inactive Publication Date: 2018-12-11
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since air is a poor conductor of heat, the thermal resistance of the heat dissipation path is very large, which is not conducive to the effective transfer of heat; moreover, the heat dissipation path will increase after the heat is transmitted through different media for many times, which is not conducive to the heat dissipation. Heat is dissipated as quickly as possible to the outside of the electronic device

Method used

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  • Copper clad laminates, printed circuit boards and electronic device
  • Copper clad laminates, printed circuit boards and electronic device
  • Copper clad laminates, printed circuit boards and electronic device

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Embodiment Construction

[0045] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

[0046] The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term...

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PUM

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Abstract

The present disclosure relates to copper clad laminates, printed circuit boards and electronic devices. The copper clad laminate comprises a base material layer and a copper foil layer laminated on atleast one surface of the base material layer, wherein the copper foil layer is used for manufacturing a target circuit pattern; The copper clad laminate further comprises at least one heat conductivelayer; The technical proposal of the invention can be provided with a heat conductive layer on the copper clad laminate or between adjacent copper clad laminates, so that when the copper clad laminate is processed into a printed circuit board and electronic components are installed, heat generated by the operation of the electronic components can be dispersed in all directions through the heat conductive layer to avoid local high temperature; Moreover, the heat transfer process does not need to pass through the air and other medium with large thermal resistance, which is conducive to improvethe heat dissipation efficiency of electronic equipment.

Description

technical field [0001] The present disclosure relates to the technical field of terminals, and in particular to a copper clad laminate, a printed circuit board and electronic equipment. Background technique [0002] Electronic equipment includes many electronic components to support the normal operation of electronic equipment. Usually, most of these electronic components are set on the circuit board in the equipment, and when working, the heat generated by these electronic components is passed through the air, shielding cover, etc. After multiple propagations by various media, it diverges from the shell structure on the electronic device to the outside of the device. [0003] However, since air is a poor conductor of heat, the thermal resistance of the heat dissipation path is very large, which is not conducive to the effective transfer of heat; moreover, the heat dissipation path will increase after the heat is transmitted through different media for many times, which is n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0207
Inventor 姜国刚
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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