Unlock instant, AI-driven research and patent intelligence for your innovation.

Irregular wafer testing method and computer-readable storage medium based on fully automatic probe station

A wafer testing, irregular technology, used in computing, semiconductor/solid state device testing/measurement, image analysis, etc., to solve problems such as weak testing

Active Publication Date: 2020-07-14
广东利扬芯片测试股份有限公司
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned fully automatic probe station is unable to test when facing irregular wafers with non-standard shapes.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Irregular wafer testing method and computer-readable storage medium based on fully automatic probe station
  • Irregular wafer testing method and computer-readable storage medium based on fully automatic probe station
  • Irregular wafer testing method and computer-readable storage medium based on fully automatic probe station

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] See figure 1 , in this embodiment, it involves an aluminum plate 3, a conductive glue 2, an irregular wafer 1 to be tested and a fully automatic probe station not shown in the figure, and the fully automatic probe station is used for testing the wafer.

[0030] There is a conventional processor on the fully automatic probe station, a camera device for photographing wafers, a wafer table for placing wafers, and a vacuum for absorbing wafers on the wafer table under the wafer table adsorption device.

[0031]The aluminum plate 3 is an aluminum plate 3 that is the same size as a standard wafer and has a smooth surface. The body of the aluminum plate 3 is provided with a vacuum suction groove 31 composed of multiple parallel slots. The top surface of the aluminum plate 3 is covered with a conductive glue 2 (preferably silica gel). ), the top surface of the conductive adhesive 2 is white with obvious color difference compared with the surface color of the irregular wafer 1,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an irregular wafer testing method based on an automatic probe table and a computer-readable storage medium thereof, A computer-readable storage medium stores a program that isexecuted by a processor of an automatic probe station to implement the method, and an irregular wafer is placed on the top surface of the conductive adhesive and placed on the table by an aluminum plate on the bottom surface of the conductive adhesive. The irregular wafer is placed on the top surface of the conductive adhesive. Since the center axis of the air permeable circular hole on the conductive adhesive is inclined, the image pickup device does not photograph the aluminum plate on the bottom surface of the conductive adhesive. During testing, by performing gray scale processing on an image captured by the image capturing apparatus, the outer contour of the non-zero color block with the largest peripheral gray value is selected as the edge of the irregular wafer, By selecting the initial center of irregular wafer, the minimum circumscribed circle / maximum inscribed circle is determined, and the scanning area of the wafer is the minimum circumscribed circle / maximum inscribed circle, which is used to scan the whole wafer / the edge of the wafer.

Description

technical field [0001] The present invention relates to an irregular wafer testing method based on a fully automatic probe station and its computer-readable storage medium. The computer-readable storage medium stores a program, and the program is executed by a processor of a fully automatic probe station to realize the described method. Background technique [0002] In the production stage of the wafer, it is necessary to use a probe station for electrical testing. The current probe station has two types: semi-automatic and fully automatic. Among them, the fully automatic probe station needs to position the wafer on the wafer table before testing. , so as to determine the wafer scanning area of ​​the wafer, and the probe will test the wafer with a specified path (full chip scanning or edge scanning) in the wafer scanning area. During the positioning process, the wafer is placed on the wafer holder of the automatic probe station, and the vacuum adsorption device under the wa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G06T7/62G06T7/66G06T7/13
CPCG06T7/60H01L22/30
Inventor 袁俊
Owner 广东利扬芯片测试股份有限公司