Dust-proof heat dissipation switch cabinet
A heat-dissipating switch and dust-proof technology, applied in the substation/switch layout details, substation/switchgear cooling/ventilation, electrical components, etc., can solve the problems of safety hazards, circuit safety hazards, slow heat dissipation of switch cabinets, etc.
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Embodiment 1
[0017] like figure 1 As shown, a dust-proof and heat-dissipating switch cabinet of the present invention includes a cabinet body, and the cabinet body includes an outer body 1 and an inner cavity body 2. There is a cavity structure between the outer body body 1 and the inner cavity body 2, and the outer body body 1 and the inner cavity body The cavity 2 is connected by bolts 7; the bottom of the inner cavity 2 is provided with a fan blade 10, the fan blade 10 is connected with the power supply 8 through the first rotating shaft 9, the power supply 8 is arranged in the cavity structure, and the inner cavity 2 is provided with a metal Silk screen 13; the outer surface of the inner cavity body 2 is provided with a heat dissipation plate, the outer surface of the outer shell 1 is provided with a second heat dissipation plate 6, and a semiconductor cooling plate 4 is arranged between the first heat dissipation plate 3 and the second heat dissipation plate 6, and the first The heat ...
Embodiment 2
[0024] like figure 1 As shown, a dust-proof and heat-dissipating switch cabinet of the present invention includes a cabinet body, and the cabinet body includes an outer body 1 and an inner cavity body 2. There is a cavity structure between the outer body body 1 and the inner cavity body 2, and the outer body body 1 and the inner cavity body The cavity 2 is connected by bolts 7; the bottom of the inner cavity 2 is provided with a fan blade 10, the fan blade 10 is connected with the power supply 8 through the first rotating shaft 9, the power supply 8 is arranged in the cavity structure, and the inner cavity 2 is provided with a metal Silk screen 13; the outer surface of the inner cavity body 2 is provided with a heat dissipation plate, the outer surface of the outer shell 1 is provided with a second heat dissipation plate 6, and a semiconductor cooling plate 4 is arranged between the first heat dissipation plate 3 and the second heat dissipation plate 6, and the first The heat ...
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