Supercharge Your Innovation With Domain-Expert AI Agents!

Systems, methods, and computer program products for identifying defects in manufactured components using locally adaptive thresholds

A technology of computers and computer processors, which is applied in the field of detecting defects in manufacturing components, and can solve problems such as limiting the sensitivity of inspection algorithms, not having enough representativeness, and complex design patterns in logic areas

Active Publication Date: 2020-01-07
KLA CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Often logic regions are so complex in design pattern that statistics for the entire region are not sufficiently representative of specific localized areas with possible defects
This will limit the sensitivity of the test algorithm

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Systems, methods, and computer program products for identifying defects in manufactured components using locally adaptive thresholds
  • Systems, methods, and computer program products for identifying defects in manufactured components using locally adaptive thresholds
  • Systems, methods, and computer program products for identifying defects in manufactured components using locally adaptive thresholds

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The following description discloses systems, methods, and computer program products provided for identifying manufacturing component defects using locally adaptive thresholds. It should be noted that any integrated and / or separate computer and inspection system (e.g., wafer inspection, master reticle inspection, laser scanning inspection system, etc.) (e.g., Figure 1A This system, method and computer program product are implemented in the context of the inspection system described in B), including the various embodiments described below.

[0017] Additional embodiments relate to a non-transitory computer-readable medium storing program instructions executable on a computer system to perform a computer-implemented method for identifying manufacturing component defects using locally adaptive thresholds. Figure 1A An example of this is shown in . Specifically, as Figure 1A Shown in , computer readable medium 100 embodies program instructions 102 executable on computer...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a system, method and computer program product for identifying defects in manufactured components using locally adaptive thresholds. In use, images are received for target and reference components of a manufacturing device. Additionally, a difference image is generated from the target and reference component images, and defect candidates for the target component are identified from the difference image. Further, for each of the identified defect candidates at a location in the difference image: determining a threshold based on a local area around the location of the defect candidate, and comparing the locations of the defect candidates and the threshold to determine whether the defect candidate is a defect.

Description

[0001] Related applications [0002] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 309,613, filed March 17, 2016, which is incorporated herein by reference in its entirety. technical field [0003] The present invention relates to inspection of manufactured components, and more particularly to detection of defects in manufactured components. Background technique [0004] Defect inspection plays a key role in yield management of semiconductor wafer processing for integrated circuit (IC) manufacturing. The same may be true for other manufactured components. The identification of the presence or absence of defects is based on the wafer image obtained from the optical system. [0005] Currently, defects in a fabricated assembly (e.g., a wafer) can be detected by comparing a target assembly (e.g., a portion of a target die) of a fabrication apparatus to a reference assembly (e.g., a corresponding portion of another reference die) of the fabr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00
CPCG06T2207/20224G06T7/001G06T2207/30148G06T7/11
Inventor 黃彤姜旭光永·张
Owner KLA CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com