Substrate processing apparatus and substrate processing method

Abstract

The purpose of the present invention is to narrow the processing width of a peripheral portion of a substrate, and to improve the uniformity of the processing width. In order to achieve the purpose, asubstrate processing apparatus according to the present invention comprises: a holding member which holds a substrate substantially horizontally from below and which is provided so as to be rotatablearound a predetermined rotation axis; a rotary member capable of rotating the holding member around the rotation axis; a separate member disposed on the outer side of the substrate along a radial direction of the substrate with a gap from an end face of the substrate being held by the holding member; and a nozzle that ejects a processing liquid from above an ejection target area included in an upper surface of the separate member so that at least a part of the processing liquid hits the ejection target area. The gap between the separate member and the end face of the substrate is set such that the processing liquid that has hit the ejection target area flows on an upper surface of the separate member, is ejected from an inner end on the rotation axis side of the upper surface, and hits anupper surface peripheral portion of the substrate from above.

Description

technical field [0001] The present invention relates to semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for plasma displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, glass substrates for photomasks, substrates for solar cells, etc. (hereinafter referred to as A substrate processing apparatus for processing a "substrate"). Background technique [0002] As such a substrate processing apparatus, Patent Document 1 discloses a holding member that holds the substrate horizontally and a ring that surrounds the entire circumference of the substrate at a distance from the end surface of the substrate along the peripheral portion of the substrate while rotating together, A device that ejects the processing liquid so as to land on the center of the upper surface of the substrate. The ring surface is hydrophilic. In the case where the surface of the substrate is hydrophobic, if the ri...

AI Technical Summary

Problems solved by technology

However, in the apparatus of Patent Document 2, when the processing liquid is discharged to the outside from the peripheral portion of the substrate, since the ring surrounding the substrate blocks the flow of the processing liquid, the discharge of the processing liquid is hindered.

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