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Laser packaging device and method

A technology of laser encapsulation and encapsulation method, which is applied in the direction of laser welding equipment, electrical components, circuits, etc., can solve the problems of poor airtightness of peeled-off encapsulation, and achieve the effects of improving airtightness, improving process adaptability, and saving costs

Active Publication Date: 2018-12-28
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In view of this, the object of the present invention is to provide a laser packaging device and a packaging method to solve the problem of poor sealing of the peel-off package

Method used

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  • Laser packaging device and method

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Embodiment Construction

[0059] The laser packaging device and packaging method proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the invention will be apparent from the claims and the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0060] refer to figure 1 , this embodiment provides a laser packaging device, which can be formed on a packaging substrate such as Figure 4 , Figure 5 As shown in the appearance of the spot, the light intensity from the edge of the spot to the center of the spot on the surface perpendicular to the direction of the laser beam travels gradually decreases. Figure 4 , the light intensity distribution of the spot can be divided into the first section A a...

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Abstract

The invention provides a laser packaging device and method. The laser packaging device is used for shooting a laser beam to a packaging base to form a light spot, the light intensity is gradually reduced from the edge of the light spot to the center of the light spot on the surface perpendicular to the direction of the advancing path of the laser beam, and the light spot comprises a first sectionclose to the edge of the light spot and a second section close to the center of the light spot. The light intensity reducing rate of the first section is smaller than that of the second section, and the boundary position of the first section and the second section is a first inflection point. The laser beam with the light spot is used for packaging the packaging base to effectively improve the uniformity of the dosage irradiated to a glass material, and thus the airtightness of the glass material is further improved.

Description

technical field [0001] The invention relates to the field of optoelectronic semiconductors, in particular to a laser packaging device and a packaging method. Background technique [0002] Optoelectronic semiconductor devices have been widely used in various fields of life. Among them, OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) has become a research hotspot due to its good color ratio, wide viewing angle, high response speed and other characteristics, and has a good application prospect. However, electrodes and organic layers in OLED devices are very sensitive to oxygen and moisture. Oxygen and moisture permeating into OLED devices from the external environment will seriously shorten the lifetime of OLED devices. Therefore, it is very important to provide an effective hermetic seal for OLED devices. The hermetic sealing of OLED devices has the following requirements: [0003] The hermetic seal shall provide protection against oxygen (10 -3 cm 3 / r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/20B23K26/06B23K26/073H01L51/52H01L51/56
CPCB23K26/0626B23K26/073B23K26/206H10K59/8722H10K59/875H10K71/421B23K26/06B23K26/20B23K26/0732
Inventor 蓝科戈亚萍
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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