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Packaging structure

A technology of packaging structure and packaging cover, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of reduced alignment accuracy and offset of the falling position of the substrate, and achieves the effect of ensuring alignment accuracy.

Active Publication Date: 2019-01-01
BOE TECH GRP CO LTD
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] In the pressing process of the traditional process, the upper stage is usually used to absorb the substrate, and the lower stage carries the glued cover plate. After the alignment between the substrate and the cover plate is completed according to the mark (Mark), the upper stage releases the substrate, and the substrate falls with the cover plate. Bonding and packaging are completed. During the release process of the substrate, due to the vibration of the machine and the turbulence of the residual gas in the chamber, the falling position of the substrate is shifted, and the alignment accuracy is reduced by more than tens of microns.

Method used

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Embodiment Construction

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0028] During the release process of the substrate 1, due to the vibration of the machine and the turbulence of the residual gas in the chamber, the falling position of the substrate 1 is shifted, which reduces the alignment accuracy. To solve the above problems, this embodiment provides a packaging structure, including the substrate 1 and the package cover 2, the substrate 1 is provided wi...

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Abstract

The invention relates to a packaging structure, and the packaging structure comprises a substrate and a packaging cover plate, wherein the substrate is provided with a first limiting member, and the packaging cover plate is provided with a second limiting member which is matched with the first limiting member so as to achieve the buckling limiting of the substrate and the packaging cover plate. The invention has the beneficial effects that the pressing of the substrate and the cover plate is completed with the aid of the first limiting member and the second limiting member to ensure the alignment accuracy.

Description

technical field [0001] The invention relates to the technical field of display product manufacturing, in particular to a packaging structure. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) is a display lighting technology that has gradually developed in recent years, especially in the display industry. Due to its advantages of high response, high contrast, and flexibility, it is considered to have a wide range of applications. prospect. However, since the OLED device will be corroded and damaged under the action of water vapor and oxygen, it is particularly important to select a better packaging method for the OLED device. [0003] Currently commonly used OLED encapsulation methods include film encapsulation, Frit encapsulation, Dam&Fill encapsulation, etc. Among them, Dam&Fill packaging, that is, using cofferdam glue (Dam) and filling glue (Filler) to complete the packaging method of the device, due to its good water and ox...

Claims

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Application Information

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IPC IPC(8): H01L23/31
CPCH01L23/3107H01L23/3121H01L2223/54426H01L2223/54486H01L2223/5442H01L23/544H01L23/10H01L23/24H10K50/8426
Inventor 罗程远申永奇
Owner BOE TECH GRP CO LTD
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