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Die bonding device

A technology of chip welding and racking, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of poor uniformity of flux particle distribution, and achieve the effects of saving labor input, increasing uniformity, and uniform distribution

Active Publication Date: 2020-05-12
泸州龙芯微科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention intends to provide a chip welding device to solve the problem of poor uniformity of flux particle distribution in the prior art after the flux is sprinkled

Method used

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Examples

Experimental program
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Embodiment Construction

[0021] The following is further described in detail through specific implementation methods:

[0022] The reference signs in the drawings of the description include: frame 1, clamping frame 2, first support spring 3, drive shaft 4, cam 5, support block 6, drive frame 7, adjusting air bag 8, push rod 9, round head 10. Cylinder 11, conduit 12, pressing bolt 13, roller 14, support plate 15, support rod 16, brush rod 17, brush 18, first bevel gear 19, second bevel gear 20, threaded rod 21, spreading material Box 22, friction plate 23, fur layer 24, rubber collection box 25, second support spring 26, lead frame 27.

[0023] The embodiment is basically as attached figure 1 Shown: a chip welding device, including a frame 1, a clamping mechanism, a driving mechanism, a spreading mechanism, a sweeping mechanism and a collecting mechanism.

[0024] The clamping mechanism is used to clamp the lead frame 27 to be sprayed with flux particles. The clamping mechanism includes a clamping fr...

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PUM

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Abstract

The invention relates to the field of chip processing and discloses a chip bonding device, comprising a frame, a clamping mechanism and a material sweeping mechanism. The clamping mechanism comprisesa clamping frame which is slidably connected with the frame transversely. A first support spring is fixedly connected between one end of the clamping frame and the frame, and a driving mechanism is arranged at the other end of the clamping frame. The driving mechanism comprises a driving shaft which is vertically rotatably connected with the machine frame, a cam which is intermittently contacted with a clamping frame is fixedly connected with the driving shaft coaxially, a driving part for driving the material sweeping mechanism is arranged on a clearance sleeve on the driving shaft above thecam, the driving part is fixedly connected with the material sweeping mechanism, and a support block fixedly connected with the driving shaft is arranged below the driving part. The invention solves the problem of poor uniformity of flux particle distribution after flux spreading in the prior art.

Description

technical field [0001] The invention relates to the field of chip processing, in particular to a chip welding device. Background technique [0002] The chip is an important part of the semiconductor device. During the processing of the semiconductor, the semiconductor chip and the carrier need to be welded to form a stable connection. The leads are the output terminals of the information of the semiconductor chip. After the semiconductor chip is welded, the two leads of the semiconductor need to be welded. [0003] The existing lead wire welding method is first to arrange the lead wires regularly on the lead frame, and the lead frame is provided with a number of grooves, and the big ends of the lead wires are clamped in the grooves. In order to ensure the firmness of lead wire welding, it is necessary to place Sprinkle flux into the groove. The existing method of sprinkling flux is to manually place the flux particles on the lead frame, and then manually shake the lead fra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/85H01L2224/85051
Inventor 黄晓波
Owner 泸州龙芯微科技有限公司