A flexible board easy to assemble a circuit board and an assembling system thereof

Abstract

The invention relates to a flexible board easy to assemble a circuit board and an assembling system thereof, comprises a flexible board body, a main via region, a standard pad region and a pair of positioning holes, wherein the main via region and the standard pad region are respectively arranged at two ends of the flexible board body, a pair of positioning holes are close to the standard pad region, and the pair of positioning holes are symmetrical along the vertical centerline of the flexible board body; A main via hole correspond to that electrical network of the pins of the photoelectric device or module to be fabricated or tested is arranged in the main via hole area. In the standard pad area there is a set of standard pads that correspond to the electrical network of the main vias and conform to industry standards. The invention has the advantages of effectively avoiding the abnormality caused by the complete symmetry of the external dimension and the deflection of the pins to one side of the component soldering and assembling, and avoiding the poor butt joint or even misalignment of the pads of the flexible board and the test circuit board although the pads are dense.

Description

technical field [0001] The invention relates to the technical field of photoelectric communication equipment, in particular to a flexible board that is easy to assemble a circuit board and an assembly system thereof. Background technique [0002] In the optical fiber communication system, the optical transceiver integrated module has become a modular unit of the communication system. With the diversification of optical communication performance and the improvement of communication reliability, the optical transceiver integrated module is gradually moving towards long-distance, high-speed, hot-swappable and intelligent direction of development. The emergence of XFP has solved the long-distance, high-speed, hot-swappable and intelligentization of optical transceiver integrated modules, and has become an important part of high-end products of optical fiber communication systems. [0003] In the optical transceiver device, TOSA is connected to the transceiver module through the...

AI Technical Summary

Problems solved by technology

However, if the component is shifted towards the position where the preset pad is located by a certain distance, although the component pins can be aligned with the preset pad, the position of the entire component on the circuit board has deviated from the correct soldering position, which may As a result, the surrounding pads preset for other components are blocked or covered, which affects the welding of other components, and many components are polarized. Once the welding is abnormal, the loss will be huge.

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