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High-density integrated circuit packages for improved solder strength and reflow methods thereof

An integrated circuit, welding strength technology, applied in the direction of circuits, electrical components, electrical solid devices, etc.

Active Publication Date: 2019-01-08
中山市盈利佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no effective method in the industry to completely solve the ball and socket phenomenon

Method used

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  • High-density integrated circuit packages for improved solder strength and reflow methods thereof
  • High-density integrated circuit packages for improved solder strength and reflow methods thereof
  • High-density integrated circuit packages for improved solder strength and reflow methods thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Such as figure 1 and figure 2 As shown, the high-density integrated circuit package for improving soldering strength includes a second base 6, a second solder ball 7, an S tube 81, a first base 9, and a first chip 11, and the second base 6 is stacked on the first On the upper side of the base 9, the second solder ball 7 is arranged between the second base 6 and the first base 9 so that there is no contact between the second base 6 and the first base 9; the first chip 11 is arranged between the second base 6 and the first base 9 Between the first substrate 9 and flip-chip on the upper surface of the first substrate 9; there are multiple second solder balls 7, which are evenly distributed between the first substrate 9 and the second substrate 6 and form a solder ball array; S tube 81 Including not less than three long tubes and not less than two short tubes, the long tubes and short tubes are connected at intervals to form an S shape, in which the long tubes are paralle...

Embodiment 2

[0055] like Figure 3 to Figure 6 As shown, the difference between this embodiment and Embodiment 1 is that an internal return pipe 12 is provided on the upper side of the first chip 11, and a communication pipe is provided on the upper side of the first substrate 9, and the communication pipe and the S pipe 81 are connected end to end to form The closed outer return pipe 8 ; the contact between the inner return pipe 12 and the outer return pipe 8 enables heat transfer between the inner return pipe 12 and the outer return pipe 8 . The second chip 3 and the third chip 2 are arranged on the upper surface of the second base 6, and the second chip 3 and the third chip 2 are stacked in a naked way, and are bonded through the wire 4; in order to fix the second chip 3 and the third chip 2 are fixed together by potting glue 1 . In this embodiment, the height of the first solder ball 10 is about 0.23 mm, the thickness of the first base 9 is about 0.3 mm, the thickness of the second ba...

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Abstract

The invention discloses a high-density integrated circuit package for improving solder strength and a reflow method thereof, comprising a second substrate, a second solder ball, an S tube, a first substrate, a first chip, and a second substrate stacked on an upper side of the first substrate, wherein the second solder ball is disposed between the second substrate and the first substrate so as notto contact the second substrate and the first substrate; The first chip is disposed between the second substrate and the first substrate and flipped on the upper surface of the first substrate. The invention provides an S tube arranged on a solder ball array between two substrates, the S tube divides the solder ball array into a plurality of rows of solder balls, The three sides of each row of solder balls are provided with S tubes as a 'city wall' to block, guide and temporarily collect the incoming hot air flow, so that the air flow around the solder balls located in the interior is relatively concentrated, the solder balls can be insulated for a short time, the solder balls can be fused more deeply, and the ball socket phenomenon can be reduced or avoided.

Description

technical field [0001] The invention relates to a semiconductor structure and technology, in particular to a high-density integrated circuit package for improving welding strength and a reflow method thereof. Background technique [0002] Modern portable electronic products put forward higher requirements for microelectronic packaging, and its constant pursuit of lighter, thinner, smaller, high reliability, and low power consumption promotes the development of microelectronic packaging towards a higher-density three-dimensional packaging method , stacked chip packaging is a widely used three-dimensional packaging technology, stacked packaging not only improves the packaging density, but also reduces the length of the interconnection wires between chips, thereby improving the operating speed of the device, and through stacking Layer encapsulation can also realize the multifunctionality of the device. Stacked chip packaging is to stack multiple chips in the vertical direction...

Claims

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Application Information

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IPC IPC(8): H01L23/24H01L23/34H01L23/427H01L23/498H01L21/60
CPCH01L23/49816H01L24/83H01L23/24H01L23/345H01L23/427H01L2224/8321H01L2224/48091H01L2224/73204H01L2924/00014
Inventor 李义政
Owner 中山市盈利佳电子有限公司
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