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Integrated circuit packaging and its reflow method for improving soldering strength

A technology of integrated circuits and welding strength, applied in the direction of circuits, electrical components, electrical solid devices, etc.

Active Publication Date: 2019-08-20
中山市盈利佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no effective method in the industry to completely solve the ball and socket phenomenon

Method used

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  • Integrated circuit packaging and its reflow method for improving soldering strength
  • Integrated circuit packaging and its reflow method for improving soldering strength
  • Integrated circuit packaging and its reflow method for improving soldering strength

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Such as figure 1 with figure 2 As shown, the integrated circuit package for improving soldering strength includes a second base 6, a second solder ball 7, an S tube 81, a first base 9, and a first chip 11, and the second base 6 is stacked on the first base 9 The upper side of the upper side, the second solder ball 7 is arranged between the second substrate 6 and the first substrate 9 so that there is no contact between the second substrate 6 and the first substrate 9; the first chip 11 is arranged between the second substrate 6 and the first substrate 9 Between the substrates 9 and flip-chip on the upper surface of the first substrate 9; there are multiple second solder balls 7, which are evenly distributed between the first substrate 9 and the second substrate 6 and form a solder ball array; the S tube 81 includes a number There are no less than three long tubes and no less than two short tubes. The long tubes and short tubes are connected at intervals to form an S s...

Embodiment 2

[0055] Such as Figure 3 to Figure 6 As shown, the difference between this embodiment and Embodiment 1 is that an internal return pipe 12 is provided on the upper side of the first chip 11, and a communication pipe is provided on the upper side of the first substrate 9, and the communication pipe and the S pipe 81 are connected end to end to form The closed outer return pipe 8 ; the contact between the inner return pipe 12 and the outer return pipe 8 enables heat transfer between the inner return pipe 12 and the outer return pipe 8 . The second chip 3 and the third chip 2 are arranged on the upper surface of the second base 6, and the second chip 3 and the third chip 2 are stacked in a naked way, and are bonded through the wire 4; in order to fix the second chip 3 and the third chip 2 are fixed together by potting glue 1 . In this embodiment, the height of the first solder ball 10 is about 0.23 mm, the thickness of the first base 9 is about 0.3 mm, the thickness of the second...

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Abstract

The invention discloses an integrated circuit package for improving welding strength and a reflow method thereof, comprising a second base, a second solder ball, an S tube, a first base, and a first chip, and the second base is stacked on the first base side, the second solder ball is arranged between the second substrate and the first substrate so that there is no contact between the second substrate and the first substrate; the first chip is arranged between the second substrate and the first substrate and flip-chip on the first substrate the upper surface of the base. In the present invention, an S tube is arranged on the solder ball array between two layers of substrates, and the S tube divides the solder ball array into multiple rows of solder balls, and the three sides of each row of solder balls have S tubes as the hot air flow that will enter the "city wall". Carry out blocking, guiding, and temporary gathering, so that the airflow around the internal solder balls is more concentrated, and achieve a short-term heat preservation effect for the solder balls, so that the solder balls can fuse more deeply, reducing or avoiding the phenomenon of ball sockets.

Description

technical field [0001] The invention relates to a semiconductor structure and technology, in particular to an integrated circuit package for improving welding strength and a reflow method thereof. Background technique [0002] Modern portable electronic products put forward higher requirements for microelectronic packaging, and its constant pursuit of lighter, thinner, smaller, high reliability, and low power consumption promotes the development of microelectronic packaging towards a higher-density three-dimensional packaging method , stacked chip packaging is a widely used three-dimensional packaging technology, stacked packaging not only improves the packaging density, but also reduces the length of the interconnection wires between chips, thereby improving the operating speed of the device, and through stacking Layer encapsulation can also realize the multifunctionality of the device. Stacked chip packaging is to stack multiple chips in the vertical direction and then pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/24H01L23/34H01L23/427H01L23/498H01L21/60
CPCH01L23/49816H01L24/83H01L23/24H01L23/345H01L23/427H01L2224/8321H01L2224/48091H01L2224/73204H01L2924/00014
Inventor 李义政
Owner 中山市盈利佳电子有限公司
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