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Domain Structure of Bonding Pads

A technology of regional structures and bonding pads, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc.

Active Publication Date: 2020-06-16
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The main purpose of the present invention is to provide a regional structure of bonding pads, which replaces the conventional design of elongated bonding pads by using a forward and reverse T-shaped staggered design, so as to solve the problem of flexible circuit board adhesive design, and simultaneously solve the problem of Solve the problem of secondary dispensing, so as to improve the reliability of the product

Method used

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  • Domain Structure of Bonding Pads
  • Domain Structure of Bonding Pads
  • Domain Structure of Bonding Pads

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Embodiment Construction

[0027] The regional structure of the bonding pads of the present invention is mainly used in electronic watches capable of touch display. In order to improve the regional structure of the bonding pads in a narrow space, the setting of the bonding pads is improved to provide the final product, which has the advantages of saving costs. , save manpower, and improve product reliability, and the bonding pad design of the present invention can save the alignment marks that need to be designed separately.

[0028] First, please refer to this invention figure 1 , figure 2 As shown, the regional structure 30 of the bonding pad of the present invention is arranged between the flexible circuit board assembly 26 and the induction module 28, and is used to connect the metal traces 27 of the two, and then please refer to image 3 As shown, a bonding pad region structure 30 includes a bonding pad region 32 and a bending region 34. There are a plurality of T-shaped bonding pads 322 and a pl...

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Abstract

The present invention provides an area structure of a bonding pad, comprising a bonding pad region and a bending region, A plurality of T-shaped bonding pads and a plurality of inverted T-shaped bonding pads are provided in the bonding pad region, The T-shaped bonding pads and the inverted T-shaped bonding pads are arranged in a staggered manner on the bonding pad region, and the bent region is bonded with the bonding pad region. The invention improves the shape of the bonding pad and shortens the length of the bonding pad without changing the contact area of the bonding pad.

Description

technical field [0001] The present invention relates to an improved arrangement of bonding pads, in particular to an improved area structure of bonding pads with the same total area. Background technique [0002] In the past, with the rapid development of technology, many different touch panel applications have been created, for example, they can be applied in tablet computers, smart phones, or various home appliances. Today, the application of touch panels can even be applied to smaller electronic products, such as smart watches, and the range of touch and display is different from that of large devices in the past. [0003] In today's smart watches, between the flexible printed circuit assembly (FPCA) and the sensing module, bonding pads are used to connect the wires of the flexible printed circuit assembly and the sensing module. Generally speaking, the conventional The joint pad system can be of elongated design. [0004] Continuing from the previous paragraph, in such...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L24/11H01L24/14H01L2224/14051H01L2224/14131H01L2224/14133
Inventor 李其裕巩厚富任慧敏
Owner INTERFACE TECH CHENGDU CO LTD
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