Integrated circuit chip testing sorting device and working method thereof

A technology for integrated circuits and sorting devices, which is applied in the field of integrated circuit chip testing and sorting devices, can solve problems such as low testing efficiency and complex structure, and achieve the effects of high work efficiency, high testing precision, and accurate positioning

Pending Publication Date: 2019-01-11
JIANGSU COLLEGE OF INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing fully automatic turret test system has complex structure and low test efficiency

Method used

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  • Integrated circuit chip testing sorting device and working method thereof
  • Integrated circuit chip testing sorting device and working method thereof
  • Integrated circuit chip testing sorting device and working method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0031] Referring to Fig. 1, the integrated circuit chip test and sorting device includes a test and sorting platform 11, and an automatic feeding system 1, a positioning system 2, a Mark detection system 3, a direction correction system 4, and a testing system arranged on the test and sorting platform 11 5. 3D detection system 6, braiding system 7, discharge system 8, overflow system 9 and turret system 10. The turret system 10 is located at the center of the test sorting platform 11 . The first, second, third, fourth, fifth, sixth, seventh, eighth, ninth and tenth functions are evenly arranged radially on the outer edge of the test sorting platform 11 around the turret system 10 Station. Feeding system 1, positioning system 2, Mark detection system 3, direction correction system 4, first test system 5, second test system 5, 3D detection system 6, tape system 7, discharge system 8 and overflow system 9 , correspondingly installed on the first, second, third, fourth, fifth, s...

Embodiment approach 2

[0045] Embodiment 2 is basically the same as Embodiment 1, except that there is one testing system 5, nine functional stations, a feeding system 1, a positioning system 2, a Mark detection system 3, a direction correction system 4, The first test system 5, the second test system 5, the 3D detection system 6, the braiding system 7, the discharge system 8 and the overflow system 9 are installed in the first, second, third, fourth and third Fifth, sixth, seventh, eighth, and ninth functional stations.

[0046] The working method of Embodiment 2 is as follows: the integrated circuit chip enters the turret system 10 through the automatic feeding system 1, the vacuum suction pen on the first functional station takes out the chip, and the direct drive servo main motor 10.1 rotates one grid, that is, rotates 40 °, the vacuum suction pen absorbs the chip and moves to the positioning system 2 on the second functional station. The positioning system positions the chip at the center of the ...

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PUM

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Abstract

The invention discloses an integrated circuit chip testing sorting device and a working method of the integrated circuit chip testing sorting device. The device comprises a testing sorting platform, aturret system is arranged on the center portion of the testing platform, a plurality of function stations are arranged around the turret system, and the function stations are provided with an automatic feeding system, a positioning system, a Mark detection system, a direction correcting system, a testing system, a 3D detection system, a braiding system and a discharging system in sequence. The turret system comprises a rotary table and a fixed table, the rotary table is driven by a direct drive servo main motor to rotate, the rotary table is provided with a plurality of vacuum suction pens, when the direct drive servo main motor is rotated by every one gird, the vacuum suction pens reach another function station from one function station, the fixed table is provided with a plurality of independent pressing mechanisms, and the independent pressing mechanisms drive the vacuum suction pens to press and suck a chip. The device is simple and compact in structure, high in testing precisionand high in working efficiency.

Description

technical field [0001] The invention relates to the technical field of integrated circuit chip testing, in particular to an integrated circuit chip testing and sorting device and a working method thereof. Background technique [0002] Test sorting technology has always been a popular technology in the IC field, and it is an indispensable process in the field of IC test packaging. The invention of the testing and sorting technology for packaged integrated circuits is a key technology that is at the forefront of science and technology. The fully automatic turret test system is mainly used for the test and sorting of inventive packaging circuits such as QFN, CSP, SOIC, etc. Cutting and other functions. The existing fully automatic turret test system has complex structure and low test efficiency. Contents of the invention [0003] The invention provides a device for testing and sorting integrated circuit chips and its working method. The device can complete automatic handli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/344B07C5/02B07C5/36
CPCB07C5/02B07C5/344B07C5/362B07C5/365
Inventor 芦俊潘小华
Owner JIANGSU COLLEGE OF INFORMATION TECH
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