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A flexible copper clad laminate with high thermal conductivity and high heat dissipation and preparation method thereof

A flexible copper-clad laminate, high heat dissipation technology, applied in chemical instruments and methods, synthetic resin layered products, coatings, etc., can solve the problem of inability to meet heat conduction and heat dissipation requirements, limit application and development, poor heat conduction and heat dissipation performance, etc. problems, to achieve the effect of improving thermal conductivity, good heat dissipation, and high thermal conductivity

Active Publication Date: 2020-11-20
SHAANXI FELDSPAR ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since PI or PE are both insulating plastics, their thermal conductivity and heat dissipation performance are poor, generally 0.2W / m·K, making polyimide (PI) or polyester (PE) films unable to meet the requirements of existing LEDs, power supplies, etc. The heat conduction and heat dissipation requirements of high-power electronic equipment limit its application and development

Method used

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  • A flexible copper clad laminate with high thermal conductivity and high heat dissipation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1. A flexible copper-clad laminate with high thermal conductivity and high heat dissipation, comprising copper foil, a thermally conductive insulating layer and a thermally conductive polyetherimide layer arranged on the copper foil in sequence,

[0028] The heat-conducting insulating layer is composed of the following raw materials in parts by weight:

[0029] 40 parts of nitrile rubber modified epoxy resin, 8 parts of boron nitride, 8 parts of silicon nitride, 30 parts of aluminum oxide, 3 parts of dicyandiamide;

[0030] The heat-conducting polyetherimide layer consists of the following raw materials in parts by weight:

[0031] 90 parts of polyetherimide, 15 parts of graphene, 20 parts of silicon carbide, 3 parts of tungsten dioxide, 5 parts of 3-aminopyridine;

[0032] Wherein, the thickness of the thermally conductive polyetherimide layer is 0.1 mm; the thickness of the thermally conductive insulating layer is 30 μm.

[0033] 2. The preparation method of the abo...

Embodiment 2

[0039] 1. A flexible copper-clad laminate with high thermal conductivity and high heat dissipation, comprising copper foil, a thermally conductive insulating layer and a thermally conductive polyetherimide layer arranged on the copper foil in sequence,

[0040] The heat-conducting insulating layer is composed of the following raw materials in parts by weight:

[0041] 70 parts of nitrile rubber modified epoxy resin, 15 parts of boron nitride, 15 parts of silicon nitride, 45 parts of aluminum oxide, 8 parts of dicyandiamide;

[0042] The heat-conducting polyetherimide layer consists of the following raw materials in parts by weight:

[0043] 120 parts of polyetherimide, 30 parts of graphene, 40 parts of silicon carbide, 6 parts of tungsten dioxide, 10 parts of 3-aminopyridine;

[0044] Wherein, the thickness of the thermally conductive polyetherimide layer is 1.0 mm; the thickness of the thermally conductive insulating layer is 60 μm.

[0045] 2. The preparation method of the...

Embodiment 3

[0051] 1. A flexible copper-clad laminate with high thermal conductivity and high heat dissipation, comprising copper foil, a thermally conductive insulating layer and a thermally conductive polyetherimide layer arranged on the copper foil in sequence,

[0052] The heat-conducting insulating layer is composed of the following raw materials in parts by weight:

[0053] 50 parts of nitrile rubber modified epoxy resin, 10 parts of boron nitride, 10 parts of silicon nitride, 40 parts of aluminum oxide, 5 parts of dicyandiamide;

[0054] The heat-conducting polyetherimide layer consists of the following raw materials in parts by weight:

[0055]100 parts of polyetherimide, 20 parts of graphene, 30 parts of silicon carbide, 4 parts of tungsten dioxide, 8 parts of 3-aminopyridine;

[0056] Wherein, the thickness of the thermally conductive polyetherimide layer is 0.3 mm; the thickness of the thermally conductive insulating layer is 50 μm.

[0057] 2. The preparation method of the a...

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Abstract

The invention discloses a flexible copper-clad plate with high heat conductivity and high heat dissipation, wherein the flexible copper-clad plate comprises a copper foil, and a heat conductive insulation layer and a heat conductive polyetherimide layer which are arranged on a copper foil successively. The heat conductive insulation layer is composed of the following raw materials in parts by weight: 40-70 parts of epoxy resin modified by butadiene-acrylonitrile rubber, 8-15 parts of boron nitride, 8-15 parts of silicon nitride, 30-45 parts of alumina and 3-8 parts of dicyandiamide. The heat conductive polyetherimide layer is composed of the following raw materials in parts by weight: 90-120 parts of polyetherimide, 15-30 parts of graphene, 20-40 parts of silicon carbide, 3-6 parts of tungsten dioxide and 5-10 parts of 3-aminopyridine. The prepared copper-clad plate has good heat dissipation and high heat conductivity, and can reach 8-10 W / m*K.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a flexible copper clad laminate with high thermal conductivity and high heat dissipation and a preparation method thereof. Background technique [0002] With the rapid development of the electronic information industry, the volume and size of electronic products are getting smaller and smaller, and the power density is getting higher and higher, which requires electronic products to have excellent heat dissipation performance. Copper-clad laminate, also known as the base material, is a plate-shaped material formed by impregnating the reinforcing material with resin, covering one or both sides with copper foil, and hot pressing. [0003] The existing flexible copper-clad laminates are mainly made of polyimide (PI) or polyester (PE) films covered with copper foil, which are widely used in the fields of telecommunication appliances and LED lighting. However...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/06B32B27/28B32B27/20B32B37/06B32B37/10
CPCB32B15/08B32B15/20B32B27/06B32B27/20B32B27/281B32B37/06B32B37/10B32B2255/06B32B2255/26B32B2307/302
Inventor 郭凯华郭长奇
Owner SHAANXI FELDSPAR ELECTRONICS MATERIALS CO LTD