Flexible semiconductor composite film and preparation method thereof

Abstract

The invention provides a flexible semiconductor composite film and a preparation method thereof. The flexible semiconductor composite film is prepared by providing a heterocomposite structure comprising a sacrificial substrate and a heterocomposite film on the surface of the sacrificial substrate. The sacrificial substrate has an etching surface, and a groove structure extending inwardly from theetching surface is formed in the sacrificial substrate. The heterocomposite film is located on the surface of the etching surface. Providing a flexible substrate bonding the flexible substrate to a side of the heterogeneous film remote from the etching surface; Flexible semiconductor composite films are prepared by etching sacrificial substrate and heterogeneous film. The flexible semiconductor composite film of the invention and the preparation thereof increase the etching rate of the later stage and also ensure the integrity of the prepared flexible semiconductor film by photoetching the groove structure in a sacrificial substrate (such as an oxide layer); Heterocomposite structure prepare by ion implantation and stripping is combine with chemical etching, so that that preparation of theflexible single crystal semiconductor film can cover most of the semiconductors.

Description

technical field [0001] The invention belongs to the technical field of semiconductor material preparation, and in particular relates to a flexible semiconductor composite film and a preparation method. Background technique [0002] Traditional microelectronics use hard silicon substrates, glass, and organic plastics as substrates, which can avoid damage to devices during use. However, they also have weaknesses such as excessive thickness and low flexibility. This limits the application of microelectronic devices in larger fields. Recently, with the widespread attention of artificial intelligence, flexible smart wearable products have been developed rapidly. Therefore, it has become a development trend to make microelectronic devices intelligent, portable, lightweight, and ergonomically designed. [0003] The basis of the preparation of flexible devices is to realize the preparation of flexible materials. At the beginning of the 20th century, it was found that organic elect...

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Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a flexible semiconductor composite film and its preparation method, which is used to solve the problem that it is difficult to obtain a flexible inorganic semiconductor thin film composite substrate in the prior art and is easy to be damaged during the preparation process. Integrity of inorganic semiconductor films, etc.

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