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Package detection device

A detection device and packaging technology, applied in the field of analysis, can solve problems such as inability to accurately detect the packaging quality of the packaging, and achieve the effect of accurate detection

Pending Publication Date: 2019-01-11
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a package detection device, which is used to solve the problem that the prior art cannot accurately detect the packaging quality of the package, so as to ensure the accuracy of the analysis and detection results of the package

Method used

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Experimental program
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Embodiment Construction

[0033] The specific implementations of the package inspection device and the package inspection method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0034] In the package, one end of the gold wire is connected to the chip, and the other end is connected to the solder ball through the metal wiring in the package substrate, so as to transmit external electrical signals to the chip. When performing failure analysis or reverse analysis on the package, it is necessary to detect the connection performance between the solder ball with a diameter of about 300 μm and the gold wire with a diameter of about 20 μm. For example, in the failure analysis, it is known that the solder ball and the gold wire are The design is connected, and it is necessary to confirm whether there is a problem with the connection line between the solder ball and the gold wire in the actual product; for example, in reverse analysis, it is nece...

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Abstract

The invention relates to the technical field of analysis, in particular to a package detection device. The package body detecting device comprises a bearing part having a bearing surface for contacting with the package body solder ball, a lead-out surface opposite to the bearing surface, and a through hole penetrating the bearing part; a lead-out portion adapted to electrically connect the solderball from the lead-out surface through the through hole to the solder ball on the bearing surface to lead the contact of the solder ball out to the outside of the package; a detection section electrically connecting the lead-out section and the gold wire in the package at the same time, for detecting the electrical connection performance of the solder ball and the gold wire in the package. The invention can realize the accurate detection of the electric connection performance of the gold wire and the solder ball under the condition of being stably connected with the gold wire and the solder ball at the same time, and ensures the accuracy of the analysis of the package body and the detection result.

Description

technical field [0001] The invention relates to the technical field of analysis, in particular to a package detection device. Background technique [0002] With the development of planar flash memory, the production process of semiconductors has made great progress. However, in recent years, the development of planar flash memory has encountered various challenges: physical limits, existing development technology limits, and storage electron density limits. In this context, in order to solve the difficulties encountered in planar flash memory and pursue lower production costs per unit storage unit, various three-dimensional (3D) flash memory structures have emerged, such as 3D NOR (3D or not) flash memory and 3D NAND (3D NAND) flash memory. [0003] Among them, 3D NAND memory takes its small size and large capacity as the starting point, and the design concept of highly integrated storage units stacked in three-dimensional mode is to produce a memory with high storage dens...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L27/11524H01L27/11551H01L27/1157H01L27/11578H10B41/20H10B41/35H10B43/20H10B43/35
CPCH01L22/14H10B41/35H10B41/20H10B43/35H10B43/20
Inventor 林万建刘秋艳张顺勇梁山安
Owner YANGTZE MEMORY TECH CO LTD