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Radiator for power module and vehicle having same

A power module and heat sink technology, which is applied in semiconductor devices, electrical solid state devices, cooling/ventilation/heating transformation, etc., can solve the problems of low heat dissipation efficiency, high cost of heat sink, complicated welding process, etc., and achieve low cost and high production efficiency. High efficiency and good cooling effect

Active Publication Date: 2022-06-21
BYD SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This results in the need for high precision tolerances when welding the two cooling flat tubes, a complicated welding process and high cost for the radiator
And it is impossible to control whether the power module is too tight or too loose when inserted, resulting in the power module being squeezed or the contact between the power module and the heat dissipation flat tube is not tight, and the heat dissipation efficiency is low

Method used

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  • Radiator for power module and vehicle having same
  • Radiator for power module and vehicle having same
  • Radiator for power module and vehicle having same

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Embodiment Construction

[0036] The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as a limitation of the present invention.

[0037] The heat sink 1 for a power module according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0038] like Figure 1-Figure 14 As shown, the heat sink 1 for a power module according to an embodiment of the present invention includes a flat heat dissipation tube 100 and a power device 200 .

[0039] A plurality of flat heat dissipation tubes 100 are arranged at intervals along the front-rear direction (the front-rea...

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Abstract

The invention discloses a radiator for a power module and a vehicle with the same. The radiator for a power module includes: a plurality of flat tubes for cooling, and the flat tubes for cooling are arranged at intervals along the front and rear direction, so that The power device of the power module is clamped between two adjacent heat-dissipating flat tubes, each of the heat-dissipating flat tubes is provided with a front water connection on the front surface and a rear water connection on the rear surface; Among the heat dissipation flat tubes, the rear water passage interface of the front heat dissipation flat pipe is pluggably connected to the front water passage interface of the rear heat dissipation flat pipe. The heat sink for a power module according to the embodiment of the present invention has the advantages of good heat dissipation effect, low cost and high production efficiency.

Description

technical field [0001] The present invention relates to the technical field of radiators, in particular, to a radiator for a power module and a vehicle having the radiator for a power module. Background technique [0002] In the related art, the radiating flat tubes of the radiator are connected by welding, and the process is complicated and the cost is high. Due to the high temperature of soldering, the power module must be installed between two flat cooling tubes after the radiator is fabricated. As a result, high precision tolerance is required when welding and connecting two flat heat dissipation tubes, the welding process is complicated, and the cost of the heat sink is high. In addition, it is impossible to control whether the power module is inserted too tightly or too loosely, resulting in the power module being squeezed or the contact between the power module and the heat dissipation flat tube is not close, and the heat dissipation efficiency is low. SUMMARY OF T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/367H01L23/433H01L23/473
CPCH01L23/31H01L23/367H01L23/433H01L23/473H01L25/07H05K7/20
Inventor 陈银方林霞杨小华
Owner BYD SEMICON CO LTD