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A method for additively manufacturing copper circuit board patterns

A technology of additive manufacturing and circuit boards, which is applied in printed circuit manufacturing, conductive pattern formation, printed circuit, etc., can solve the problem of high thermal conductivity, low heat absorption rate, low laser energy utilization rate, and difficulty in melting copper alloy powder layer by layer And other problems, to achieve broad application prospects, to meet the rapid effect

Active Publication Date: 2020-08-11
GRIPM ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper alloy is a reflective material, which will reflect the laser during the laser melting process, resulting in low energy utilization of the laser. At the same time, the high thermal conductivity of copper will also reduce the heat absorption rate during the 3D printing process. These two characteristics make It is difficult for laser to melt copper alloy powder layer by layer

Method used

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  • A method for additively manufacturing copper circuit board patterns

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Utilize the present invention to prepare a kind of concrete method step of copper circuit board pattern as follows:

[0018] (1) Select nano-copper powder with a particle size ranging from 10 to 50 nm;

[0019] (2) Mix the nano-powder selected in step (1) with the spherical powder whose particle size range is 30-50 μm according to the ratio of 1:3;

[0020] (3) Use the mixed powder in step (2) to print the predetermined circuit pattern on the PCB by controlling the laser power of 50W, the scanning rate of 200mm / s, the scanning distance of 0.01mm, and the powder thickness of 0.05mm by using a 3D printer;

[0021] (4) The printed PCB circuit board in step (3) is annealed and stress-relieved at a temperature of 220° C. in a reduction furnace for 3 hours.

Embodiment 2

[0023] Utilize the present invention to prepare a kind of concrete method step of copper circuit board pattern as follows:

[0024] (1) Select nano-copper powder with a particle size ranging from 50 to 100 nm;

[0025] (2) Mix the nano-powder selected in step (1) with the spherical powder whose particle size range is 50-75 μm according to the ratio of 1:3;

[0026] (3) Use the mixed powder in step (2) to print the predetermined circuit pattern on the PCB by controlling the laser power of 75W, the scanning rate of 350mm / s, the scanning distance of 0.03mm, and the powder thickness of 0.075mm by using a 3D printer;

[0027] (4) The printed PCB circuit board in step (3) is annealed and stress-relieved at a temperature of 260° C. in a reduction furnace for 2 hours.

Embodiment 3

[0029] Utilize the present invention to prepare a kind of concrete method step of copper circuit board pattern as follows:

[0030] (1) Select nano-copper powder with a particle size ranging from 100 to 200 nm;

[0031] (2) Mix the nano-powder selected in step (1) with the spherical powder with a particle size range of 75-100 μm in a ratio of 1:3;

[0032] (3) Use the mixed powder in step (2) to print the predetermined circuit pattern on the ceramic substrate by controlling the laser power of 100W, the scanning rate of 500mm / s, the scanning distance of 0.05mm, and the powder thickness of 0.1mm by using a 3D printer ;

[0033] (4) The ceramic circuit board printed in step (3) is annealed and stress-relieved at a temperature of 300° C. in a reduction furnace for 1 hour.

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Abstract

The invention discloses a method for manufacturing a copper circuit board pattern by adding materials, and belongs to the technical field of circuit board manufacturing. The specific technological process is as follows: Firstly, nano-copper powder with particle size ranging from 10 nm to 200 nm is selected; the nano-copper powder is then mixed with a spherical copper powder suitable for 3D printing; And then the mixed copper powder is printed on the surface of the PCB board or the ceramic substrate according to a preset pattern by a laser 3D printer; Finally, the printed PCB or ceramic substrate is annealed to eliminate the internal stress and print defects. This method can replace the traditional electroplating. Etching manufacturing technology, with the characteristics of short process and friendly environment, can meet the needs of rapid, personalized manufacturing, high precision and wide fine wire, and has broad application prospects.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, in particular to a method for additively manufacturing copper circuit board patterns. Background technique [0002] Printed circuit board (PCB circuit board) is one of the indispensable accessories in all kinds of contemporary electronic equipment. The current printed circuit board has the characteristics of high density, high precision, high reliability, designability and maintainability. Therefore, it is widely used in the electrical connection of electronic components. However, printed circuit boards have the disadvantages of being difficult to decompose and easily pollute the environment, especially when printing and manufacturing single-piece small-batch circuit boards, there are defects of low efficiency and high cost. [0003] 3D printing technology belongs to the field of additive manufacturing, which is to superimpose materials layer by layer through 3D printing to obta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12
CPCH05K3/1275
Inventor 张少明张敬国潘旭王立根胡强汪礼敏刘祥庆付东兴王永慧周友智
Owner GRIPM ADVANCED MATERIALS CO LTD
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