A kind of apu-al high-frequency high-dielectric low-loss material and preparation method thereof

Abstract

The invention relates to an APU-Al high-frequency high-dielectric low-loss material preparation method, and belongs to the technical field of dielectric materials. The method comprises: (1) heating Alpowder to ensure the generation of a passivation film alumina so as to be spare; (2) mixing the Al powder obtained in the step (1) and an acrylic acid polyurethane precursor, and ultrasonically dispersing to uniformly distribute the aluminum powder into the acrylic acid polyurethane precursor; (3) continuously adding the curing agent of the acrylic acid polyurethane precursor to the step (2), carrying out stirring mixing, ultrasonically dispersing, and spraying a base plate with the obtained mixed slurry to obtain a resin film; and (4) curing the resin film in the step (3) to ensure the in-situ polymerization reaction of the acrylic acid polyurethane so as to obtain the APU-Al high-frequency high-dielectric low-loss material. According to the present invention, the prepared APU-Al high-frequency high-dielectric low-loss material has advantages of high dielectric constant, low dielectric loss, simple process and low manufacturing cost.

Description

technical field [0001] The invention relates to the technical field of dielectric materials, in particular to a high-frequency high-dielectric low-loss material and a preparation method thereof. Background technique [0002] High dielectric and low loss materials are the key to the preparation of capacitors. With the continuous development of electronic information and microwave communication technology towards high frequency, the application frequency band of capacitors is also increasing. Due to the relaxation characteristics of dielectric materials, the dielectric constant decreases with the increase of frequency, especially at high frequency, the dielectric constant drops sharply, so the realization of high dielectric at high frequency has always restricted the development of capacitor materials. In addition, electronic devices are becoming more and more miniaturized, which requires higher capacitance in a smaller volume, so increasing the dielectric constant is also a ...

AI Technical Summary

Problems solved by technology

However, the general low dielectric constant (less than 10) of resin restricts its further development.

Using the percolation theory, adding conductive phases such as metals and carbon materials to the resin, when the volume fraction of the conductive phase is close to the percolation threshold, the dielectric constant can be greatly increased, but it is also accompanied by a sharp increase in loss

Images