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Backlight module, panel comprising same, and manufacturing method of backlight module

A technology of a backlight module and a manufacturing method, applied in optics, nonlinear optics, instruments, etc., can solve the problems of easy exposure of light-emitting diodes and failure to be protected, and achieve the effect of improving optical characteristics

Active Publication Date: 2019-01-22
SUMIKA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small spacing between LEDs below the sub-millimeter level, they are not packaged and are directly placed on the substrate. As a result, these LEDs are easily exposed and cannot be protected.

Method used

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  • Backlight module, panel comprising same, and manufacturing method of backlight module
  • Backlight module, panel comprising same, and manufacturing method of backlight module
  • Backlight module, panel comprising same, and manufacturing method of backlight module

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Embodiment Construction

[0057] Various embodiments are proposed below for detailed description. The embodiments are only used as examples for illustration and will not limit the scope of protection of the present invention. The present invention can still be implemented using other features, components, methods and parameters. The embodiments are presented only to illustrate the technical features of the present invention, and are not intended to limit the patent scope of the present invention. Those skilled in the art will be able to make equivalent modifications and changes according to the descriptions in the following specification without departing from the spirit of the present invention.

[0058] The light-emitting unit in the backlight module of the present invention is a light-emitting diode, and the light-emitting diode is a submillimeter light-emitting diode or a micro-light-emitting diode, and the size of the light-emitting diode is less than 500 microns, and an adhesive layer and an optic...

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Abstract

The invention discloses a backlight module, a panel comprising the same, and a manufacturing method of the backlight module. The backlight module comprises a light emitting unit, an adhesive layer, and an optical film layer. The light emitting unit is covered on the adhesive layer. The optical film layer is arranged on the adhesive layer. The adhesive layer is arranged between the optical film layer and the light emitting unit. The light emitting unit is a light emitting diode, which is a sub-millimeter light emitting diode or a micro light emitting diode. The size of the light emitting diodeis less than 500 millimeters. The light emitting diode is covered by the adhesive layer and the optical film layer, is protected, and is not exposed to the air directly. Due to the special optical design of the adhesive layer or / and the optical film layer, the optical characteristics of the light emitting diode are improved.

Description

technical field [0001] The present invention relates to a backlight module, a panel using the same and a manufacturing method thereof, and in particular to a backlight module including submillimeter light emitting diodes or micro light emitting diodes, a panel using the same and a manufacturing method thereof. Background technique [0002] Compared with the edge-lit LED backlight module, the direct-lit LED backlight module has a more uniform light transmittance and can perform full array local dimming (FALD, Full Array Local Dimming), which can have a higher contrast ratio And more details in the light and shade, becoming a very important backlight today. Generally speaking, LED chips with a size of millimeters are packaged in a bowl structure with a light-collecting effect, and phosphor powder or resin is added to the packaging structure to cover the LED to form a white LED or blue light-emitting diodes, and enable the LED chips to be protected. [0003] In recent years, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13357
CPCG02F1/133603G02F1/133606G02F1/133607G02F1/133614
Inventor 梁辉鸿陈彦年陈志添
Owner SUMIKA TECH
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