Unlock instant, AI-driven research and patent intelligence for your innovation.

sot23-x lead frame and packaging method thereof

A SOT23-X, lead frame technology, used in semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of incompatibility of forming/separating equipment molds, low frame unit density, etc., to reduce production costs, The effect of producing large quantities and high area density

Active Publication Date: 2020-07-21
FOSHAN BLUE ROCKET ELECTRONICS
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the defects that the plastic sealing equipment mold and the forming / separating equipment mold of the above-mentioned prior art are not compatible and the density of the frame unit is low, and the purpose is achieved by the following technical scheme:

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • sot23-x lead frame and packaging method thereof
  • sot23-x lead frame and packaging method thereof
  • sot23-x lead frame and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] figure 1 It is a schematic diagram of the overall structure of the existing SOT23-3 lead frame (the overall structure of the existing SOT23-5 lead frame, SOT23-6 lead frame is the same as the overall structure of the existing SOT23-3 lead frame, the difference is that the pins different quantities; in addition, in order to avoid figure 1 too complex, not all frame units are shown in the figure), figure 2 It is a schematic diagram of the overall structure of the lead frame (SOT23-3 lead frame) in Embodiment 1 of the present invention (the overall structure of the SOT23-5 lead frame and SOT23-6 lead frame in the present invention is the same as that of the SOT23-3 lead frame in Embodiment 1 The overall structure is the same, the difference is that the pin settings are different; in addition, in order to avoid figure 2 too complex, not all frame units are shown in the figure), by figure 1 and figure 2 , it can be seen intuitively that the frame unit (also referred t...

Embodiment 2

[0042] What embodiment 2 relates to is the SOT23-5 lead frame, and compared with the SOT23-3 lead frame involved in embodiment 1, the overall structure of the two is the same, the difference is that the pin arrangement in embodiment 2 Different from the pin setting in Embodiment 1.

[0043] like Figure 4 As shown, the frame unit 6 in the SOT23-5 lead frame consists of an adhesive base island 67 and pins 61, 62, 63, 64, 65, 66 distributed on both sides of the adhesive base island 67 and connected to the transverse ribs 3 Composition, wherein, pin 65 is set as a false pin, and the other five pins are actually used pins. One end of the dummy pin 65 near the plastic package is tangent to the boundary of the plastic package ( Figure 4 The dotted line box in is the boundary of the plastic package after molding).

Embodiment 3

[0045] What embodiment 3 relates to is the SOT23-6 lead frame, and compared with the SOT23-3 lead frame involved in embodiment 1, the overall structure of the two is the same, the difference is that the pin setting in embodiment 2 Different from the pin setting in Embodiment 1.

[0046] like Figure 5 As shown, the frame unit 7 in the SOT23-6 lead frame consists of an adhesive base island 77 and pins 71, 72, 73, 74, 75, 76 distributed on both sides of the adhesive base island 77 and connected to the transverse ribs 3 Composition, the six pins are actually used pins.

[0047] Above, the structural features of the present invention have been described in detail through three embodiments. It should be emphasized that the SOT23-3 lead frame and the SOT23-5 lead frame in the present invention are all provided with six pins in form, of course, the former has three pins as false pins, and the latter has one pin is a dummy pin. like Figure 7 As shown, the SOT23-X lead frame of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a SOT23-X (X=3, 5 or 6) lead frame and encapsulation method thereof, comprises a frame body and a frame unit, wherein a transverse bar is arranged between two rows of frame units connected transversely, a longitudinal plastic sealant injection flow channel is arranged between the nth column and the (n+1) th column of frame units, and a longitudinal bar is arranged between the (n+1) th column and the (n+2) th column of frame units, wherein n is odd and 1 <= n<= 47; Each frame unit consists of an island of bonded wafers and pins, and when X=3, three dummy pins are arranged; When X=5, set a dummy pin; When X=6, no dummy pin is set. The packaging method comprises the following steps: when plastic sealing, one end of the false lead is tangent to the boundary of the plastic sealing body, and the end does not enter the plastic sealing cavity of the mold; At the time of forming separation, the false pins are set to be cut off from the effect of bending forming force. The invention realizes SOT23-X kinds of compatibility of the three encapsulation forms of the plastic mould and the forming / separating mould is improved, and the high area density of the frame unit is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a SOT23-X lead frame and a packaging method thereof. Background technique [0002] Integrated circuit packaging is a key link in the semiconductor production process. Its function is to electrically connect the bonding points of the internal chip of the integrated circuit to the outside, and provide mechanical protection for the chip from physical damage. The packaging quality of an integrated circuit directly affects its electrical parameter performance and stability. [0003] The basic process of integrated circuit packaging is: grinding and cutting the integrated circuit wafer into a single chip, bonding it to the base island of the lead frame through conductive adhesive, insulating adhesive or eutectic process, etc., leading from the chip bonding point to the corresponding On the pins of the lead frame, and then use polymer materials to mold it th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L21/50
CPCH01L21/50H01L23/49541H01L23/49565H01L2224/97
Inventor 陈逸晞袁凤江邱焕枢王光明杨全忠颜志扬
Owner FOSHAN BLUE ROCKET ELECTRONICS