Heat dissipation system and electronic device with heat dissipation system

A technology for electronic devices and heat dissipation fins, which is applied in electrostatic cleaning, cleaning methods and appliances, cooling/ventilation/heating transformation, etc., can solve the problems such as difficult dust removal of heat dissipation fins, so as to avoid disassembly and assembly of electronic devices and slow down The effect of dust accumulation

Inactive Publication Date: 2019-01-22
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention is to provide a heat dissipation system and an electronic device with the heat dissipation system, so as to solve the problem in the known technology that the heat dissipation fins located inside the electronic product are not easy to remove dust

Method used

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  • Heat dissipation system and electronic device with heat dissipation system
  • Heat dissipation system and electronic device with heat dissipation system
  • Heat dissipation system and electronic device with heat dissipation system

Examples

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no. 1 example

[0041] Compared with the aforementioned first embodiment, the heat dissipation system 230 of this embodiment adds a deflector 240 located on the same side of the air outlet 2322 of the airflow generator 232, and the ion generator 233 may not be interposed between the airflow generator 232 and the cooling fins Between the sheets 231, the deflector 240 is used to guide the airflow 2322a blown out by the airflow generator 232 to the ion generator 233, so that the positive and negative ions generated by the ion generator 233 can be carried by the airflow 2322a to dissipate heat The fins 231 are used to supply power to neutralize the positively charged dust in the high-speed airflow 2322a, and the cooling fins 231 are negatively charged by friction with the high-speed airflow 2322a.

[0042] The cooling fins 231 in the above embodiment are made of insulating material to avoid electrostatic induction caused by the charged dust in the cooling fins 231 and the airflow 2322a. The insula...

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PUM

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Abstract

The invention discloses an electronic device, comprising a housing, an electronic component, a heat dissipation fin, an air flow generator and an ion generator. The housing is provided with a receiving space and an air inlet corresponding to the receiving space. The electronic component is located in the accommodation space. The heat dissipation fins are located in the accommodation space and areconnected to the electronic components. The airflow generator is located in the accommodation space. The air flow generator has an air inlet and an air outlet, the air inlet corresponds to the air inlet, and the air outlet is used for supplying an air flow to the heat dissipation fin. An ion generator is located on the airflow path between the heat dissipation fin and the airflow generator, and isused for generating ions. The ion generator is arranged on the airflow path between the heat dissipation fin and the airflow generator.

Description

technical field [0001] The invention relates to a cooling system and an electronic device with the cooling system, more specifically, a cooling system with an ion generator and an electronic device with the cooling system. Background technique [0002] In recent years, with the rapid development of electronic technology, the calculation speed of electronic components inside electronic equipment has been continuously improved. The power consumption of each electronic component continues to increase and heat energy is generated with it. Therefore, in order to prevent electronic components from overheating and causing hysteresis in operation, or even temporary failure and shutdown. Therefore, sufficient heat dissipation must be provided so that the electronic device can operate at a normal temperature. [0003] At present, the heat dissipation method commonly used in electronic products adopts a fan and heat dissipation fins to provide active heat dissipation. For example, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20B08B6/00
Inventor 江孟龙
Owner INVENTEC PUDONG TECH CORPOARTION
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