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A lithographic prewetting apparatus and a lithographic prewetting method

A pre-wetting and photolithography technology, which is applied in the direction of photoplate-making process coating equipment, etc., can solve the problems of high solvent consumption and film defects, etc., and achieve the effect of easy removal and improved cleanliness

Inactive Publication Date: 2019-01-25
HUAIAN IMAGING DEVICE MFGR CORP
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Problems solved by technology

[0004] However, in the existing pre-wetting process, the solvent consumption is large, and when there are particle defects on the wafer surface, it is easy to produce film defects after coating the photoresist

Method used

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  • A lithographic prewetting apparatus and a lithographic prewetting method
  • A lithographic prewetting apparatus and a lithographic prewetting method
  • A lithographic prewetting apparatus and a lithographic prewetting method

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Embodiment Construction

[0025] In the existing photolithography process, in order to make the photoresist coated on the wafer surface more smoothly, before the photoresist is coated, a solvent can be input to the wafer surface for pre-wetting, so that the wafer surface Uniform coating of photoresist is easier to achieve in the presence of moisture.

[0026] refer to figure 1 , figure 1 It is a structural schematic diagram of a photolithography pre-wetting device in the prior art.

[0027] The lithography pre-wet equipment may include a wafer base 100 , a pre-wet solvent pipeline 110 and a pre-wet solvent container 130 .

[0028] Wherein, the wafer base 100 can be used to place the wafer 102 , and the pre-wet solvent container 130 can be used to place the pre-wet solvent.

[0029] The pre-wet solvent pipeline 110 may be connected to the pre-wet solvent container 130 , and the pre-wet solvent pipeline 110 may be used to guide the pre-wet solvent to the surface of the wafer 102 .

[0030] Further, t...

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Abstract

A lithographic prewetting apparatus and a lithographic prewetting method, the lithographic prewetting apparatus comprising a wafer base for placing a wafer; A pre-wetted solvent container for storingthe pre-wetted solvent; A pre-wetting solvent line connected to the pre-wetting solvent container, the pre-wetting solvent line for guiding the pre-wetting solvent to a surface of the wafer; A micro-nano bubble generating device is connected with the pre-wetting solvent pipeline, and is used for generating micro-nano bubbles and transferring the micro-nano bubbles into the pre-wetting solvent in the pre-wetting solvent pipeline. The micro-nano bubbles generating device is used for generating micro-nano bubbles and transferring the micro-nano bubbles into the pre-wetting solvent in the pre-wetting solvent pipeline. The scheme of the invention is helpful to reduce defects on the wafer surface and adhesive film defects in subsequent processes.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a lithography pre-wetting device and a lithography pre-wetting method. Background technique [0002] In the existing semiconductor manufacturing process, photolithography, as a precise microfabrication technology, plays an extremely important role. [0003] In the photolithography process, it is necessary to use a photoresist coating process to transfer the mask pattern to the wafer surface. In order to make the photoresist more smoothly coated on the wafer surface, before the photoresist coating, Firstly, a solvent is input to the surface of the wafer for pre-wet (Pre-wet), so that it is easier to achieve uniform coating of photoresist on the surface of the wafer in the presence of moisture. [0004] However, in the existing pre-wetting process, the solvent is consumed more, and when there are particle defects on the surface of the wafer, it is easy to produce film defect...

Claims

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Application Information

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IPC IPC(8): G03F7/16
CPCG03F7/16
Inventor 沈雪苏延洪柯汎宗黄志凯叶日铨
Owner HUAIAN IMAGING DEVICE MFGR CORP
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