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Transfer substrate, manufacturing method and transfer method

A technology for transferring substrates and transfer methods, applied in semiconductor/solid-state device manufacturing, electrical components, piezoelectric/electrostrictive/magnetostrictive devices, etc.

Active Publication Date: 2019-01-25
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, Micro-LEDs are generally grown on the sapphire substrate and need to be transferred to the display substrate. However, how to transfer Micro-LEDs from the original substrate to the display substrate is also the main technical bottleneck affecting Micro-LEDs.

Method used

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  • Transfer substrate, manufacturing method and transfer method
  • Transfer substrate, manufacturing method and transfer method
  • Transfer substrate, manufacturing method and transfer method

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Embodiment Construction

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0047]Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are on...

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Abstract

The invention discloses a transfer substrate, a manufacturing method and a transfer method, so as to provide a novel transfer substrate and a transfer method applied to a massive transfer process of amicro light emitting diode. The transfer substrate comprises: substrate substrate, a plurality of electrodeformed frames located on the substrate and distributed in a manner matched to the distribution manner of the microlight emitting diodes of the original substrate, the inner side of the frame is surrounded and formed with a hollow area which is larger than the area occupied by the orthogonalprojection of the micro light emitting diode on the original substrate when the frame is not subjected to an electric field; The hollow area is reduced to be smaller than the area occupied by the orthogonal projection of the micro light emitting diode on the original substrate; As that electric field is remove, shrinkage occurs and the hollow area return to the original state.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a transfer substrate, a manufacturing method and a transfer method. Background technique [0002] Micro-LED (Micro-LED) is a new generation of display technology. Micro LED has obvious advantages. It inherits the characteristics of high efficiency, high brightness, high reliability and fast response time of inorganic LED, and has self-illumination without backlight. Features, more energy-saving, simple mechanism, small size, thin and other advantages. [0003] At present, Micro-LED is still in the research and development stage. The main process of Micro-LED includes: LED chip production, mass transfer of LED chips, and welding of LED chips and display substrates. That is, Micro-LEDs are generally grown on a sapphire substrate and need to be transferred to a display substrate. However, how to transfer Micro-LEDs from the original substrate to the display substrate is also...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77H10N30/20H10N39/00
CPCH01L27/1214H01L27/1259H01L27/1266H01L27/1218H01L21/67144H01L25/167H10N39/00H10N30/206
Inventor 方立宇孙凌宇杜景军梁菲侯婷琇
Owner BOE TECH GRP CO LTD
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