Pushing removal device and working method
A panel and abutment technology, applied in the field of pushing and removing devices, can solve problems such as unstable operation of personnel, burns of polarizers, unstable temperature, etc., and achieve the effect of solving abnormal efficiency and quality
Inactive Publication Date: 2019-01-29
NANJING CEC PANDA LCD TECH
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- Application Information
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Problems solved by technology
[0004] 1. Generally, the IC removal device uses electric soldering iron to heat the IC, and the heating core damage frequency is high;
[0005] 2. Due to the unstable operation of personnel during the IC removal process, there are fragments and terminal scratches with abnormal quality;
[0006] 3. Since the heating of the electric soldering iron is a single-item heating, the temperature is unstable, and it is easy to cause abnormal quality such as polarizer burns;
[0007] 4. There are different types of LCD panel models, and the replacement frequency of the corresponding fixtures carried by the LCD panel is high, and the customization time is long, which affects the work progress
Method used
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[0043] The push-off device of the present invention is used to remove the panel IC, such as Figure 2-Figure 3 As shown, it includes a base 1 and a push-off device body located on the base 1; the push-off device body includes a push-off part 2 of a push-off panel IC, a platform part 3 of a support panel, and a control push-off part 2 according to the IC push-off distance, The touch part 4 that performs the start-up action and the removal action based on parameters such as removal speed and IC heating time.
[0044] Wherein, the pushing part 2 includes a base 21 and a removal device 22 fixed on the base 21, the base 21 is movably arranged on the base 1, and drives the removal device 22 to reciprocate, so that the removal device 22 can remove the panel IC tear down. Preferably, the base 21 is an automatic mobile device that can be controlled by the touch part 4, and a motor is used to control the movement of the base 21, so that the removal device 22 is pushed horizontally, whi...
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The invention provides a pushing removal device and a working method. The pushing removal device is used for dismantling a panel IC and comprises a base and a pushing removal device main body locatedon the base; the pushing removal device main body comprises: a pushing removal part, wherein the pushing removal part comprises a base platform and a dismantling device fixed on the base platform, andthe base platform is movably arranged on the base for driving the dismantling device to reciprocate; a platform part, wherein the platform part comprises a moving platform and a panel locking devicefixed on the moving platform, and the panel locking device fixes a liquid crystal panel on the moving platform; and a touch part, wherein the part part is used for controlling the pushing removal part. The pushing removal device provided by the invention can effectively solve the efficiency and quality abnormality in an IC pushing removal process by providing the design of multiple aspects such asan atypical closed loop temperature control system, a separate terminal non-contact oblique L-angle pushing removal device, a single-item micrometer, a spring, a guide rail adjustment device, an all-machine corresponding moving platform, automation, etc.
Description
technical field [0001] The invention belongs to the technical field of panel jigs, and in particular relates to a push-off device and a working method. technical background [0002] In the existing liquid crystal panel production process, when the crimped liquid crystal panel has a defective process, the panel needs to be reworked, that is, the IC is removed. Such as figure 1 As shown, the current industry basically uses electric soldering iron 03 to heat IC02 through the buffer material 01 for tens of seconds to soften the anisotropic conductive film ACF04 used for IC02 and panel adhesion; Fixture, manually push out IC02. [0003] Yet there is following shortcoming in prior art: [0004] 1. Generally, the IC removal device uses electric soldering iron to heat the IC, and the heating core damage frequency is high; [0005] 2. Due to the unstable operation of personnel during the IC removal process, there are fragments and terminal scratches with abnormal quality; [000...
Claims
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Login to View More IPC IPC(8): G02F1/13
CPCG02F1/1303
Inventor 吴强范圆圆李星龚剑陈静胡月田大龙
Owner NANJING CEC PANDA LCD TECH