Multi-start spiral flow channel liquid cooler for heat dissipation of electronic component

Abstract

The invention belongs to a liquid cooler for cooling of an electronic component. The liquid cooler comprises a cooling plate with a multi-start spiral flow channel, a cover plate with fins and air flow holes, an air flow cooling cavity, a spiral groove cooling liquid heat dissipating plate, a cooling liquid storage cavity, a turbine, a fan and a motor. According to the invention, a cooling plate with a multi-start spiral flow channel structure is employed, wherein a cooling liquid flows symmetrically from inside to outside in the structure, thereby effectively overcoming the defects that the temperature of a traditional radiator increases continuously along the flow direction of a cooling liquid and a cooled electronic component generates unsymmetrical thermal stress and the like; and thecooling liquid that has worked or absorbed the heat is cooled by the air flow of the fan and subjected to heat dissipation processing of the fins, and then the cooling liquid is sent to the spiral flow channel cooling plate to carry out continuous internal circulation cooling on the electronic component. Therefore, the liquid cooler provided by the invention has the characteristics that the structure is compact, the cooling effect on the electronic component is good, the temperature adjustment range is wide, adverse effects of the thermal stress on the component are effectively reduced, the electronic component can be ensured to work efficiently, stably and safely in the working environment, and the service life of the electronic component can be prolonged.

Description

technical field [0001] The invention relates to a liquid cooler for cooling electronic components, in particular to a micro-channel liquid cooler using multi-head spiral channels; the cooler can be widely used for cooling electronic components and devices such as high-power chips , to ensure the stability of its working performance and prolong its service life. Background technique [0002] At present, radiators used in electronic equipment mainly include traditional fin radiators and microchannel liquid-cooled radiators that can dissipate higher heat. Traditional microchannel radiators generally adopt a single-inlet and single-outflow channel structure; whether it is the original parallel microchannel structure or the cooling system of the fractal microchannel structure in recent years, most of the basic components include microchannels, micropumps, etc. , coolant radiator, fan, and coolant piping system. The basic principle is: the power source is provided by the micro-p...

AI Technical Summary

Problems solved by technology

Although the radiator of this type of structure can dissipate higher heat, because the temperature of the radiator will continue to rise along the direction of coolant flow, that is, the asymmetric rise, the temperature of the asymmetric change (rise) will inevitably It will produce asymmetric thermal stress on the cooled electronic components and devices. This thermal stress will have adverse effects on electronic components and devices, deform the chip or even make it invalid, especially sensitive to the miniature acceleration sensors in MEMS. This is especially true for devices

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