Electronic component plug-in mounting method and device
A technology for electronic components and circuit boards, which is applied in the field of electronic component insertion methods and devices, can solve the problems that electronic components are not inserted firmly enough, cannot be inserted into circuit boards accurately, and the clamping device cannot accurately clamp electronic components.
Pending Publication Date: 2019-01-29
SOUTH CHINA UNIV OF TECH
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Problems solved by technology
[0003] 1) The screening of electronic components mostly relies on prior knowledge, and requires manual setting of component parameters in advance. The matching and screening process of components of different sizes and circuit board holes does not have adaptive matching capabilities;
[0004] 2) The clamping device cannot accurately clamp electronic components and cannot be accurately inserted into the circuit board;
[0005] 3) The insertion of electronic components that require additional pressure insertion is not strong enough
Method used
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Embodiment Construction
[0108] The present invention will be described in further detail below.
[0109] Such as Figure 1 to Figure 5 As shown, a method for inserting electronic components includes the following steps,
[0110] S1. Calibrate the image acquisition device;
[0111] S2. Setting initial templates of electronic components and circuit boards and calculating initial deviations;
[0112] S3, image acquisition of electronic components; image acquisition of circuit boards;
[0113] S4. Perform image preprocessing on the electronic component images collected in S3 by means of mean filtering, threshold segmentation, and convex hull processing, and extract the center coordinates, angle and direction feature parameters; for the circuit board images collected in S3 , first perform threshold segmentation, then select the circuit board hole to be inserted based on the area and roundness features and perform connected domain processing, perform sub-pixel edge extraction on the obtained circuit boa...
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The invention relates to the field of electronic component plug-in mounting, and especially relates to an electronic component plug-in mounting method and device. According to the invention, characteristic parameters of an image of an electronic component and an image of a circuit board are extracted, adaptive matching is performed according to the characteristic parameters, deviation rectification is carried out on the position and attitude of a clamping device in allusion to different placement angles and placement positions of the electronic component or the circuit board, and the clampingdevice can accurately clamp the electronic component and accurately plug the electronic component in the circuit board, so that the automatic plug-in mounting efficiency is improved. The control device can control a pressure device to apply pressure to the electronic component, and the pressure is applied to the electronic component which needs additional pressure for plug-in mounting, thereby enabling the plug-in mounting to be firmer. Various control combination modes of the clamping device and the pressure device greatly improves the universality and adaptability for the plug-in mounting process of different components.
Description
technical field [0001] The invention relates to the field of electronic component insertion, in particular to an electronic component insertion method and device. Background technique [0002] With the advancement of science and technology and the rapid development of the electronic industry, circuit boards are an important carrier of electronic components, and their application fields and market demand are increasing year by year. Automatic electronic component insertion technology is an important means to increase the output of various circuit boards and reduce production costs. The prior art insertion usually uses an industrial robot with three rotating joints and one moving joint to move the clamping device. After the electronic components are removed, the joints of the industrial robot move down to insert the electronic components onto the circuit board. Because electronic components and circuit boards have the characteristics of irregular appearance and difficult visu...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/30H05K13/04H05K13/08
CPCH05K3/306H05K13/0404H05K13/08H05K2203/166H05K2203/168
Inventor 张宪民张原邱志成
Owner SOUTH CHINA UNIV OF TECH