Resin composition and insulated wire using same
A resin composition and resin technology, which can be used in plastic/resin/wax insulators, insulators, organic insulators, etc., can solve the problems of high cost, not widely popularized, and insufficient bending processing.
Active Publication Date: 2021-02-09
SUMII TECH (SHENZHEN) CO LTD
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- Abstract
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- Application Information
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Problems solved by technology
In general, the film elongation of polyesterimide used for coils is about 10%, and polyamideimide, which is known to have good processability, is only about 50%, which is not enough for severe bending.
[0003] The film elongation of polyimide is about 80%, so it can meet such severe bending processing requirements, but its cost is very high, which is about 5 times that of polyamideimide, so it is not widely used at present.
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～3
[0045] The manufacture of embodiment 1~3 polyamidoimide
[0046] Embodiments 1 to 3 are to change 25mol%, 50mol%, and 100mol% of the 4,4'-MDI of Comparative Example 1 into 2,4'-MDI, and the charging amount of the total MDI is 256g (that is, the total MDI Except that the molar ratio with TMA was 1.1:1), it manufactured by the method similar to the comparative example 1, and obtained the polyamide-imide varnish with a viscosity of 1500-5000 cps and a solid content of 35%.
Embodiment 4
[0054] The molar ratio of total MDI and TMA in Example 2 was changed to 1.2:1, and the same method as Example 2 was produced except that.
Embodiment 5
[0056] The molar ratio of total MDI and TMA in Example 2 was changed to 1.3:1, and the same method as Example 2 was produced except that.
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Abstract
The present invention relates to a resin composition containing a polyamideimide resin whose repeating unit structure contains diphenylmethane diisocyanate as a starting point, and an insulated wire using the same. The skeleton of the raw material, the diphenylmethane diisocyanate contains 2,4'-diphenylmethane diisocyanate, and the content of the 2,4'-diphenylmethane diisocyanate in the total diphenylmethane diisocyanate is 25-100 mol%, and the weight-average molecular weight of the polyamide-imide resin is 15,000-40,000.
Description
technical field [0001] The present invention relates to a resin composition and an insulated wire using the same, and more particularly to a resin composition suitable for use in coils of electrical equipment such as motors and an insulated wire using the same. Background technique [0002] Insulated wires (so-called enameled wires) are widely used as wires for coils of electrical equipment such as motors. An insulated wire generally includes a conductor and an insulating film formed on the outer peripheral surface of the conductor. This insulating film is generally obtained by applying and curing an insulating varnish (varnish) on a conductor. In recent years, in order to reduce the size and increase the output of motors, very high bending workability is required for coils used therein. In general, the film elongation of polyesterimide used for coils is about 10%, and polyamideimide, which is known to have good processability, is only about 50%, which is not enough for se...
Claims
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IPC IPC(8): C08G73/14C08L79/08H01B3/30
CPCC08G73/14C08L79/08H01B3/303
Inventor 尹勇
Owner SUMII TECH (SHENZHEN) CO LTD