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Manufacturing method of array substrate

A manufacturing method and array substrate technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of complex process and high production cost, and achieve the effects of reducing procedures, facilitating conductorization, and increasing aperture ratio

Active Publication Date: 2019-10-01
CHENGDU ZHONGDIAN PANDA DISPLAY TECH CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] Although the six-mask process technology provided by the prior art can realize the transparency and high transmittance of the pixel electrode and the storage capacitor electrode, the process is complicated and the production cost is high.

Method used

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  • Manufacturing method of array substrate
  • Manufacturing method of array substrate
  • Manufacturing method of array substrate

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Embodiment Construction

[0042] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are part of the embodiments of the present invention , but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0043] It should be noted that a traditional liquid crystal display panel is formed by laminating a thin film transistor array substrate (Thin FilmTransistor Array Substrate, TFT Array Substrate for short) and a color filter substrate (ColorFilter Substrate, CF Substrate for short), respectively. The pixel electrode and the common electrode are formed on the color filter substrate, and the li...

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Abstract

The invention provides an array substrate manufacturing method, and the method comprises the steps: sequentially depositing a metal layer and an ITO (indium tin oxide) layer on a glass substrate, andperforming the first photoetching to form a first layer structure including a gate electrode and a storage capacitor electrode; sequentially depositing a gate insulating layer, an IGZO (indium galliumzinc oxide) semiconductor layer and a source / drain metal layer on the first layer structure, and performing the second photoetching to form a second layer structure which comprises a silicon island pattern, a source and a drain; sequentially forming a passivation layer and a planarization layer formed on the second layer structure, enabling the IGZO semiconductor layer to form a conductor IGZO inthe process of forming the passivation layer, and performing the third photoetching to form a conductive via hole; depositing a transparent conductive film on the planarization layer, and performingthe fourth photoetching to form a pixel electrode, and connecting the pixel electrode and the conductive via hole. The method can realize the fabrication of the array substrate with high transmittancepixels by only four mask process sequences.

Description

technical field [0001] The invention relates to the field of liquid crystal display, in particular to a method for manufacturing an array substrate. Background technique [0002] The transmittance of the liquid crystal display panel plays an extremely important role in the overall display performance of the liquid crystal display panel. The higher the transmittance, the higher the realism of the liquid crystal display panel, and the lower the brightness of the backlight source. In order to reduce the product cost, how to improve the transmittance of the liquid crystal display panel is a very important research topic. [0003] figure 1 A schematic diagram of the circuit design of the array substrate provided in the prior art, figure 2 for figure 1 The cross-sectional view of the array substrate shown in the A-A' direction, refer to figure 1 with figure 2 As shown, the manufacturing method of the array substrate provided by the prior art includes six photomasks in the p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/77H01L27/12
Inventor 陈盈惠杨桂冬储周硕日比野吉高孙学军
Owner CHENGDU ZHONGDIAN PANDA DISPLAY TECH CO LTD