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Conductive substrate, electronic device and display device

A technology for conductive substrates and display devices, applied in the direction of conductive layers, circuits, printed circuits, etc. on insulating carriers

Active Publication Date: 2020-10-13
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, there is a limit to the production of conductive substrates at low cost

Method used

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  • Conductive substrate, electronic device and display device
  • Conductive substrate, electronic device and display device
  • Conductive substrate, electronic device and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0110] A catalyst-containing resin for forming a base layer containing 20% ​​by mass of Pd particles and an isocyanate resin was prepared. This catalyst-containing resin was coated on a PET film (thickness: 100 μm) which is a transparent substrate with a bar coater. The base layer (thickness: 100 nm) was formed by heating and curing the coating film at 80°C. Thereafter, a UV-curable transparent acrylic resin oligomer was coated on the base layer using a bar coater to form a groove-forming layer (thickness: 2 μm).

[0111] A Ni mold having a convex portion having a width of 1 μm formed with a mesh pattern was prepared. This mold was pressed against the groove-forming layer so that the tip of the convex portion of the mold reached the base layer. In this state, the groove-forming layer was cured by ultraviolet irradiation. Thus, a groove having a bottom surface exposed from the base layer is formed. The groove has a width of 1 μm, a depth of 2 μm, and an interval between adj...

Embodiment 2～5

[0114] Except that the width W (the width of the groove) of the conductive pattern layer and the thickness (the depth of the groove) of the conductive pattern layer are changed to the values ​​recorded in Table 1, all the others are made in the same way as in Example 1. Sexual substrate.

Embodiment 6～9

[0116] Except that the thickness of the conductive pattern layer (the depth of the groove) was changed to the value listed in Table 1, the conductive substrate was produced in the same manner as in Example 1.

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Abstract

The present invention relates to a conductive substrate, an electronic device and a display device. The conductive substrate is characterized by comprising: a base material, an underlayer provided on the base material, a groove-forming layer provided on the underlayer, and a conductive pattern layer including metal plating. A trench is formed having a bottom surface where the base layer is exposed. The conductive pattern layer fills the trench. The base layer has a mixed region formed from the surface of the base layer on the conductive pattern layer side to the inner side thereof and containing metal constituting the conductive pattern layer and containing metal particles entering the base layer.

Description

technical field [0001] The present invention relates to a conductive substrate, an electronic device and a display device. Background technique [0002] A transparent antenna mounted with a conductive substrate having transparency and conductivity may be mounted on the surface of a touch panel or a display. Recently, as touch panels and displays become larger and more diversified, conductive substrates are required to have high transparency and high conductivity, and also flexibility. Conventional conductive substrates have, for example, a conductive pattern layer formed of a resin containing ITO, metal foil, or conductive nanowires on a transparent substrate, in which fine patterns are formed. [0003] However, ITO or conductive nanowires are expensive materials. In addition, as a method of forming a fine conductive pattern layer on a base material, it is generally an etching (etching) method, and the necessary steps of the method completed by etching are an exposure step...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14
CPCH01B5/14H01L2933/0066H01L33/62H01L23/49866G06F3/041G06F2203/04103H01L2224/81H01L2224/16225H01B1/02H01L27/156H01L23/49838H05K1/09H05K2203/04H01L21/4857H05K2201/0338H05K2201/0341H05K3/4007G06F3/044
Inventor 大德高志谷口晋关映子佐藤淳堀川雄平折笠诚阿部寿之
Owner TDK CORPARATION