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Method for treating a micro electro-mechanical system (MEMS) component

A technology of micro-electro-mechanical systems and components, applied in the direction of electrical components, processes for producing decorative surface effects, micro-electronic microstructure devices, etc., can solve problems that are not completely satisfactory, lose design performance, and damage the sensitivity performance of MEMS motion sensors And other issues

Inactive Publication Date: 2019-02-12
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Existing methods can only solve the stiction problem by losing design performance, for example by compromising the sensitivity performance of MEMS motion sensors, and are therefore not entirely satisfactory

Method used

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  • Method for treating a micro electro-mechanical system (MEMS) component
  • Method for treating a micro electro-mechanical system (MEMS) component
  • Method for treating a micro electro-mechanical system (MEMS) component

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Embodiment Construction

[0016] The following disclosure provides many different embodiments, or examples, for implementing different features of the subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are just examples and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include that additional features may be described at An embodiment is formed between a feature and a second feature such that the first feature and the second feature may not be in direct contact. Additionally, the present invention may repeat reference numerals and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

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Abstract

A method for treating a micro electro-mechanical system (MEMS) component is disclosed. In one example, the method includes the steps of providing a first wafer, treating the first wafer to form cavities and at least an oxide layer on a top surface of the first wafer using a first chemical vapor deposition (CVD) process, providing a second wafer, bonding the second wafer on a top surface of the atleast one oxide layer, treating the second wafer to form a first plurality of structures, depositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second CVD process.

Description

technical field [0001] Embodiments of the present invention relate to a method for processing a microelectromechanical system (MEMS) component. Background technique [0002] Micro electro-mechanical system (MEMS) motion sensors are now widely used in automotive electronics, medical equipment, hard drives, and portable consumer electronics. For example, a typical smartphone includes MEMS accelerometers, gyroscopes and possibly a compass. Single-axis MEMS accelerometers detect velocity changes in a given direction and are almost universally used to inflate automotive airbags in the event of a crash. Since vibrations can be patterned into accelerations and decelerations that occur rapidly in a periodic fashion, the single-axis MEMS accelerometers are also used as vibration sensors to detect bearing wear in mechanical equipment. Dual-axis accelerometers implement a second dimension, which can be as simple as detecting tilt by measuring the effect of gravity on the X-Y axis of ...

Claims

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Application Information

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IPC IPC(8): B81C1/00
CPCB81C1/00015B81C2203/0118H01J37/347H01J37/3405H01J37/3414H01J37/3461B81B3/0005B81B2207/012B81C2201/0133B81C2201/112B81C2203/035B81C1/00912B81C1/00928B81C1/00349B81C1/0092H01L21/02499B81C1/00373B81C1/00357H01L21/02518B81C1/0096B81C1/00992B81B2201/0235B81B2201/0242B81B2201/025B81C1/00682
Inventor 翁睿均许希丞陈信宇蒋季宏程世伟吴威鼎胡景翔拉瓦亚沙纳卡瓦拉普
Owner TAIWAN SEMICON MFG CO LTD
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