Single-sided adhesive with partial glue-free surface and production method thereof

Abstract

The invention discloses a single-sided adhesive with a partially adhesive-free surface and a production method thereof. The production method comprises the following steps: S1, using a silicone film as a first base, covering the adhesive surface of the silicone film with a first release film, and covering the non-adhesive surface of the silicone film with a protective film as a second base; S2, punching the first release film with a first die; S3, removing the first release film waste after the punching, covering the first release film layer with a single-sided adhesive tape, the adhesive surface of the single-sided adhesive tape being adhered to the first release film layer and the silicone film; S4, covering the protective film and the silicone film between the punching lines of two linear cutting edges with a second release film; S5, punching the non-adhesive surface of the single-sided adhesive tape with a second die; and S6, removing the single-sided adhesive tape waste after thepunching to obtain the single-sided adhesive with a partially adhesive-free surface. The production method of the single-sided adhesive with a partially adhesive-free surface has the advantages that few auxiliary materials are used by selecting the film materials, only two times of punching is required, the whole process has a few steps, the production efficiency is high and the cost is reduced.

Description

technical field [0001] The invention relates to a production method of single-sided adhesive, in particular to a single-sided adhesive with partial glue-free surface and a production method thereof. Background technique [0002] Nowadays, electronic products such as mobile phones, tablets, and computers are being updated rapidly in the market. Manufacturers serving these electronic products --- die-cutting factories are increasingly responsible for the products they are in contact with. The production process of products requires low cost and high efficiency. obvious. In order to meet the performance of electronic products, there are more and more products with double-sided adhesive tape without adhesive on one side. [0003] At present, the die-cutting factory generally needs to carry out 3 times of die cutting for double-sided adhesive, single-sided adhesive, and one side (adhesive side) requiring partial glue-free processing, during which the release film auxiliary mater...

AI Technical Summary

Problems solved by technology

[0003] At present, the die-cutting factory generally needs to carry out 3 times of die cutting for double-sided adhesive, single-sided adhesive, and one side (adhesive side) requiring partial glue-free processing, during which the release film auxiliary materials used are at least 5 times , more materials and more processes, making the overall production efficiency lower

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