Annular temperature sensor
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- INST OF MICROELECTRONICS CHINESE ACAD OF SCI
- Publication Date
- 2019-02-15
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Abstract
Description
technical field
[0001] The invention relates to the field of sensors, in particular to an annular temperature sensor. Background technique
[0002] The wide bandgap semiconductor material SiC is an ideal material for preparing high-voltage power electronic devices, but SiC power devices are less robust than silicon-based power devices. In order to improve the reliability of the gate oxide layer of SiC power devices, we need to pay close attention to changes in device temperature, thereby reducing performance degradation of the gate oxide layer.
[0003] At present, there are mainly two types of temperature sensors used to collect SiC. One is to measure temperature using the linear relationship between the voltage drop on the PN junction barrier and temperature; the second is to use the voltage drop on the Schottky barrier and The linear relationship of temperature is used for temperature measurement, and this type of sensor consumes less power.
[0004] However, the report...