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Method and system for COB optical module automatic coupling dispensing curing

An automatic coupling and curing method technology, which is applied to the coupling of optical waveguides, pretreatment of the surface, and devices for coating liquid on the surface, etc., can solve the problems of increasing the work intensity of operators and reducing the efficiency of chip dispensing and curing.

Active Publication Date: 2019-02-15
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the prior art, when the chip is dispensing and curing the electrical device, the dispensing and curing of the electrical device needs to be accurate and firm, so it needs to be carried out in an environment with a uniform light source. Glue dispensing and curing, that is, the chip needs to be fixed before dispensing and curing. The usual method is to use a pressure plate and bolts to fix the chip, and then implement dispensing and curing. Further, in order to improve the stability of dispensing and curing, usually Multi-point fixation of the chip increases the process of the chip before and after dispensing and curing, greatly reduces the efficiency of dispensing and curing of the chip, and increases the work intensity of the operator

Method used

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  • Method and system for COB optical module automatic coupling dispensing curing
  • Method and system for COB optical module automatic coupling dispensing curing
  • Method and system for COB optical module automatic coupling dispensing curing

Examples

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Embodiment 1

[0043] A COB optical module automatic coupling dispensing curing method, it comprises the steps:

[0044] Step 1. Obtain the coupling requirements between the chip 9 and the lens when dispensing;

[0045] Step 2, determining the clamping mode of the first clamping mechanism 2 for the chip 9;

[0046] Step 3, determining the clamping mode and feeding route of the second clamping mechanism 3 for the lens;

[0047] Step 4. Determine the dispensing route and dispensing method of the dispensing mechanism 4 according to the positional relationship between the chip 9 and the lens and dispensing requirements;

[0048] Step 5. Determine the heating time, heating temperature and heating method of the heating mechanism 5 according to the positional relationship between the chip 9 and the lens and according to the curing requirements;

[0049] Step 6, converting the above requirements into preset parameters and performing presets in the adjustment control mechanism;

[0050] Step 7: St...

Embodiment 2

[0062] Such as figure 1 and 2 As shown, on the basis of Embodiment 1, this embodiment further provides a COB optical module automatic coupling dispensing and curing system, which includes a support base 1, at least one first clamping mechanism 2, and at least one second clamping mechanism 3. Dispensing mechanism 4, heating mechanism 5, and adjustment control mechanism; the first clamping mechanism 2 includes a preliminary positioning structure 6 and a locking structure 7, and the second clamping mechanism 3 includes a clamping structure and a feeding structure, The adjustment control mechanism adjusts and controls the first clamping mechanism 2, the second clamping mechanism 3, the glue dispensing mechanism 4 and the heating mechanism 5 according to preset parameters; wherein, the preliminary positioning After the chip 9 is initially positioned by the structure 6, the adjustment control mechanism instructs the locking structure 7 to lock the chip 9; the clamping structure is ...

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Abstract

The invention discloses a method for COB optical module automatic coupling dispensing curing. The method comprises the following steps: obtaining the coupling requirements between the chip and the lens when dispensing; determining a manner of clamping the chip by a first clamping mechanism; determining a clamping manner and a feeding route of the second clamping mechanism to the lens; determininga dispensing route and a dispensing method of the dispensing mechanism according to a positional relationship between the chip and the lens and a dispensing requirement; determining a heating time, aheating temperature, and a heating mode of the heating mechanism according to the positional relationship between the chip and the lens and according to a curing requirement; converting the above requirements into preset parameters and presetting them in an adjustment control mechanism; activating the COB optical module automatic coupling dispensing curing system, wherein the adjustment control mechanism sequentially controls the movement of the first clamping mechanism, the second clamping mechanism, the dispensing mechanism, and the heating mechanism according to a preset value until the entire dispensing process is completed.

Description

technical field [0001] The invention relates to the technical field of COB dispensing and curing, in particular to a COB optical module automatic coupling dispensing curing method and a COB optical module automatic coupling dispensing curing system. Background technique [0002] In the prior art, when the chip is dispensing and curing the electrical device, the dispensing and curing of the electrical device needs to be accurate and firm, so it needs to be carried out in an environment with a uniform light source. Glue dispensing and curing, that is, the chip needs to be fixed before dispensing and curing. The usual method is to use a pressure plate and bolts to fix the chip, and then implement dispensing and curing. Further, in order to improve the stability of dispensing and curing, usually Fixing the chip at multiple points increases the process of the chip before and after dispensing and curing, greatly reduces the efficiency of dispensing and curing the chip, and increas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42B05D1/26B05D3/02B05C11/10B05C9/14B05C9/12
Inventor 段吉安唐佳涂凯扬于凯旋彭晋文仲顺顺戚媛婧颜科舒斌
Owner CENT SOUTH UNIV
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