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Hybrid transmission line structure based on multilayer self-encapsulated suspended coplanar waveguide and microstrip
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A technology of transmission line structure and coplanar waveguide, which is applied in the microwave field, can solve the problems of difficult circuit miniaturization and highly integrated design, narrow transmission frequency band, and large energy loss of microwave transmission lines, so as to broaden the applicable frequency range, improve the quality factor, The effect of avoiding hysteresis effects
Active Publication Date: 2020-12-08
XIDIAN UNIV
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[0010] The purpose of the present invention is to provide a transmission line structure based on multi-layer self-encapsulated suspended coplanar waveguide and microstrip mixed to solve the problem of large energy loss, narrow transmission frequency band, and difficulty in realizing circuit miniaturization and high integration in existing microwave transmission lines. design problem
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Embodiment 1
[0048] Embodiment 1, five-layer integrated self-encapsulated suspended coplanar waveguide and microstrip hybrid transmission line structure.
[0049] refer to figure 1 , figure 2 and image 3 , the structural description of this embodiment is as follows:
[0050] figure 1 Give the hierarchical diagram of the integrated structure of this example;
[0051] figure 2 (a) The front view of the main layer of this example is given, figure 2 (b) The reverse view of the main layer of this example is given;
[0052] image 3 (a) provides the top view structure after removing the upper additional layer in this embodiment, image 3 In (a), the analysis is carried out at the positions A-A', B-B' and C-C' of the overall structure respectively; image 3 As shown in (b), A-A' shows the cross-sectional view of the feeder section of the integrated structure transmission line, BB' shows the cross-sectional view of the transition section of the integrated structure transmission line, ...
Embodiment 2
[0063] Example 2, four-layer integrated self-encapsulated suspended coplanar waveguide and microstrip hybrid transmission line structure
[0064] refer to Figure 4 , Figure 5 and Image 6 , this embodiment is described.
[0065] Figure 4 A hierarchical diagram of the integrated structure of this example is given;
[0066] Figure 5 (a) The front view of the main layer of this example is given, Figure 5 (b) The reverse view of the main layer of this example is given;
[0067] Image 6 (a) Provides the top view structure after removing the upper additional layer in this embodiment, and analyzes it at the overall structure cross section A-A', BB' and CC' positions respectively; the sectional view at each position, like Image 6 As shown in (b), A-A' shows the cross-sectional view of the feeder section of the integrated structure transmission line, BB' shows the cross-sectional view of the transition section of the integrated structure transmission line, and CC' shows...
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Abstract
The invention discloses a transmission line structure based on multi-layer self-packaging suspension coplanar waveguide and micro-strip mixing. The structure mainly solves the problems that a traditional transmission line circuit is relatively large in loss, low in circuit design flexibility and integration degree and needs to be packaged again and the like. The structure comprises a main body layer (1), an upper cavity body layer (2), a lower cavity layer (3), an upper additional layer (4) and a lower additional layer (5); a coplanar waveguide is laid on the upper surface of the main body layer; a micro-strip line guide strip is laid on the lower surface of the main body layer to form a mixed structure; the upper cavity body layer, the lower cavity body layer and the main body layer transmission line form a suspension section; the suspension section is in transition connection with input and output feeder line sections, and all layers of plate layers are bonded to form an integrated structure; copper is applied to the left side and the right side of the integrated structure, and is connected to a coplanar waveguide ground line; and the outer side of the upper additional layer andthe outer side of the lower additional layer are coated with copper, and the copper coating parts are jointed to form self packaging. The three-dimensional integrated circuit design is adopted, so that the interference of an external electromagnetic environment to a transmission signal is well avoided, and small loss and small size are realized, so that the structure can be used for designing a microwave circuit.
Description
technical field [0001] The invention belongs to the field of microwave technology, and in particular relates to a transmission line structure, which can be used in microwave distributed circuit design. Background technique [0002] In the design of microwave distributed circuits, the transmission lines of the sub-components used will generate losses, and the use of a single transmission line to design microwave circuits with different functions will inevitably have various limitations. Among the traditional transmission line structures, there are parallel transmission lines, coaxial lines, waveguides, striplines, microstrip lines and coplanar waveguides. in: [0003] Parallel double-wire transmission line, which is composed of two parallel double wires, is the simplest kind of transmission line, which can transmit transverse electromagnetic wave TEM wave, but the increase of frequency will lead to the increase of heat loss and radiation loss, so it can only be used in low-f...
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