Combined sensor and electronic equipment

Abstract

The invention discloses a combined sensor and electronic equipment. The combined sensor comprises a cover, a substrate, an environment sensor and an acoustic sensor, wherein the substrate and the cover are enclosed to form a containing cavity; the environment sensor comprises an MEMS environment chip arranged in the containing cavity and a first ASIC chip embedded in the substrate, wherein the first ASIC chip is electrically connected with the MEMS environment chip through a first pin; the acoustic sensor comprises an MEMS microphone chip arranged in the containing cavity and a second ASIC chip embedded in the substrate; the MEMS microphone chip and the second ASIC chip are electrically connected through a second pin; the MEMS environment chip and the MEMS microphone chip are arranged at intervals; and the first pin and the second pin are arranged on two opposite sides of the substrate respectively. According to the technical scheme, the interference of the environmental sensor to theacoustic sensor can be reduced.

Description

Technical field [0001] The invention relates to the technical field of chip packaging, in particular to a combined sensor and electronic equipment. Background technique [0002] As a measuring device, sensors have been widely used in mobile phones, notebook computers and various wearable electronic products. In recent years, with the development of science and technology, the volume of electronic products has continued to shrink. In order to save costs and reduce volume, sensors with different functions, such as environmental sensors and acoustic sensors, are usually integrated into the same package. For more complex sensors, different types of chips are usually introduced, such as MEMS (Micro-Electro-Mechanical System) chips or ASIC (Application Specific Integrated Circuit, integrated circuit) signal processing chips. In order to further reduce the volume, ASIC signals can be The processing chip is embedded in the substrate. [0003] At present, in order to reduce energy consump...

AI Technical Summary

Problems solved by technology

[0003] At present, in order to reduce energy consumption, environmental sensors are usually switched on and off frequently, and at the moment of switching, it will cause electromagnetic interference to the acoustic sensor. Due to the limited space of the packaging structure, the distance between the signal output end of the environmental sensor and the acoustic sensor is very close. leading to increased interference

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