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A kind of manufacturing method of electronic component storage tray

A production method and technology of electronic components, applied in the direction of electrical components, electrical components, manufacturing tools, etc., can solve the problems of storage box specifications, inconsistent materials, unsafe storage environment, and damage to electronic components, etc., to achieve uniform models, The effect of low material selection and low production cost

Active Publication Date: 2020-07-31
重庆佰全电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there is no special method for making electronic component storage containers on the market, so a large number of electronic components are temporarily stored and transported in installation boxes of different specifications, and electronic components are small and sensitive to environmental factors such as temperature and humidity. Damaged components, the specifications and materials of this temporary storage box are not uniform, not only inconvenient to transport, but also the storage environment cannot be guaranteed, so it is very easy to cause damage to electronic components under this kind of storage and transportation

Method used

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  • A kind of manufacturing method of electronic component storage tray
  • A kind of manufacturing method of electronic component storage tray
  • A kind of manufacturing method of electronic component storage tray

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with specific embodiments and accompanying drawings. The specific embodiments described here are only used to explain the present invention, and are not intended to limit the present invention.

[0033] A method for manufacturing an electronic component storage tray, the finished product made according to the method is as follows: figure 1 As shown, its specific implementation steps include the following:

[0034] S1: material selection: the core 1 selects the foam board material of the first predetermined thickness, the first fixed plate 2 and the second fixed plate 3 select the cardboard of the second predetermined thickness, and the shaping belt 4 selects the shaping paper of the third predetermined thickness;

[0035] S2: Cutting and forming, including:

[0036] S21: Use a predetermined first cutting tool to cut at one time on the foam board material to form a figure 2 As shown in the disk core...

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Abstract

The invention relates to a manufacturing method of an electronic element storage disc. The method comprises the steps that materials are selected, cutting forming is carried out, and pasting and assembling are carried out to finally obtain a finished product. The method is simple in operation step, the manufacturing standard is unified, and the manufacturing cost is relatively low. The electronicelement storage disc manufactured by using the method comprises a disc core, a first fixing disc body, a second fixing disc body and a shaping belt. The manufactured finished product can achieve storage and transportation of a large number of electronic elements.

Description

technical field [0001] The invention relates to the field of electronic component storage, in particular to a manufacturing method of an electronic component storage tray. Background technique [0002] With the advancement of science and technology, more and more electronic products have been manufactured one after another. These electronic products not only improve the production efficiency in industry, but also bring convenience to consumers in life. Among these electronic products , Electronic components are an indispensable basis of composition, and in order to reduce costs, electronic components with different functions are produced by different manufacturers in different regions, and finally assembled and assembled. This process involves the storage and transportation of electronic components. [0003] At present, there is no special method for making electronic component storage containers on the market, so a large number of electronic components are temporarily store...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D13/00B65D25/02B65D85/86B23P21/00B26D1/00
CPCB23P21/00B26D1/00B65D13/00B65D25/02B65D2585/86H05K13/0084
Inventor 雷济通
Owner 重庆佰全电子科技有限公司