A preparation method and product of glue for producing high-speed copper-clad laminates

A copper clad laminate, high-speed technology, used in adhesives, epoxy resin glue, textiles and papermaking, etc., can solve the problems of large loss, unstable transmission performance, low dielectric, etc., achieve low dielectric loss factor, meet performance requirements, The effect of low dielectric constant

Active Publication Date: 2021-03-02
重庆德凯实业股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] High-frequency and high-speed substrate materials mainly solve the high-frequency characteristic defects of unstable transmission performance and large loss of ordinary copper-clad laminates in the fields of microwave and millimeter waves in communications. , put forward a higher and more urgent demand

Method used

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  • A preparation method and product of glue for producing high-speed copper-clad laminates
  • A preparation method and product of glue for producing high-speed copper-clad laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Special glue for high-speed copper clad laminates:

[0025] 1. Bismaleimide resin modification: put 0.65g of barbituric acid, 123.5g of brominated bisphenol A epoxy resin, 11.2g of bismaleimide resin, and 77g of butyrolactone into the reactor In the process, a stable and homogeneous mixture was formed, and then reacted at 135°C for 2-3 hours, and the temperature was lowered to 65°C after the reaction stopped; butyrolactone was only used as a solvent, and bismaleimide resin, ba Bituric acid is added together, and only bismaleimide resin and barbituric acid are reacted. The reaction can be carried out at 130-150°C for 2-4 hours, and the temperature is lowered to 60-70°C after the reaction stops. The bromine element in the brominated bisphenol A epoxy resin accounts for 18-25%.

[0026] 2. Then add 75g of dimethylformamide and 24.93g of curing agent ethylenediamine, and mix together to form a uniform resin A solution;

[0027] 3. Dissolve 122g of polyphenylene ether res...

Embodiment 2

[0031] Preparation of high-speed copper clad laminate:

[0032] 1. Reinforcement material pretreatment: select low dielectric constant glass fiber cloth as the reinforcement material, and burn it at 40°C for 30 minutes, then cool it down to room temperature naturally; then soak the heat-treated low dielectric constant glass fiber cloth in the treatment solution 10-15min, air-dry naturally for 30-45min, then place it in an electric blower oven at 100°C and dry for 2H; the glass cloth treatment solution is a 1.5% aqueous solution of silane coupling agent, and then adjust the pH value with glacial acetic acid Adjust to 3-4, stir and react at room temperature for 45 minutes. The dielectric constants of the glass fiber cloth used in the examples are all between 4.2-4.5.

[0033] 2. Preparation of the adhesive sheet (semi-cured state): apply the special glue for high-speed copper-clad laminates prepared in Example 1 to the treated low-dielectric constant glass fiber cloth through t...

Embodiment 3

[0038] 1. Bismaleimide resin modification: put 1.68g of barbituric acid, 116.3g of brominated bisphenol A epoxy resin, 25g of bismaleimide resin, and 160g of butyrolactone into the reactor , to form a stable and uniform mixture, then react at 135°C for 2-3 hours, and then cool down to 65°C after the reaction stops;

[0039] 2. Then add dimethylformamide and curing agent ethylenediamine 23.12g according to the resin mass ratio of 1:5-7, and mix together to form a uniform resin A solution;

[0040]3. Dissolve 115.5g of polyphenylene ether resin in toluene (heating), then add 6.05g of dicyclopentadiene phenol epoxy resin and 5.75g of benzoyl peroxide to form a stable mixture. Under the conditions, react for 2-3 hours, and form a stable resin B solution after the reaction;

[0041] 4. Mix the resin A solution and the resin B solution evenly together, and add 0.67g of catalyst dimethylimidazole to prepare a special glue for producing high-speed copper-clad laminates.

[0042] 5. ...

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Abstract

The invention relates to a preparation method of glue for producing high-speed copper-clad laminates. Modified bis Maleimide resin; use butyrolactone as its solvent to make the modified bismaleimide resin form a stable and uniform mixture; further add other materials to prepare a special glue for producing high-speed copper-clad laminates; utilize the present invention The high-speed copper-clad laminate prepared by the prepared glue has low dielectric constant and dielectric loss factor, and can meet other performance requirements of the copper-clad laminate, and can be suitable for the production of high-speed printed circuit boards.

Description

technical field [0001] The invention relates to the field of production and preparation of copper-clad laminates, in particular to a method for preparing glue for producing high-speed copper-clad laminates and its products. Background technique [0002] With the rapid development of intelligent electronic products and the revolution of information technology, global information technology is developing rapidly towards digitization and networking. Ultra-large capacity information transmission, ultra-fast speed and ultra-high-density information processing have become the key factors in the development of information and communication equipment (ICT) technology. the goal pursued. Digital circuits are gradually entering the stage of high-speed information processing and high-frequency signal transmission. In order to process increasing data, the frequency of electronic equipment becomes higher and higher. At this time, the performance of the substrate will seriously affect the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J171/12C09J11/06C09J11/08C08G73/12D06M13/50H05K1/05C09J7/21
CPCC08G73/12C08L2203/20C08L2205/025C08L2205/03C08L2205/035C09J11/06C09J11/08C09J163/00C09J2400/143C09J7/21D06M13/50H05K1/053C08L71/12C08L79/085C08L63/00
Inventor 李洪彬
Owner 重庆德凯实业股份有限公司
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