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Method for manufacturing semiconductor package

A manufacturing method and semiconductor technology, which can be used in semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve problems such as high consumption, reduce manufacturing costs, facilitate miniaturization, and reduce the number of processes. Effect

Inactive Publication Date: 2019-02-26
BARUN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Also, for cell sputtering, a polyimide (PI) tape is used as a jig attached to a ring frame (ring frame) to place a semiconductor package, but this consumes a relatively large material cost
At the same time, the throughput per hour (UPH) caused by the unit operation is only 10K level

Method used

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  • Method for manufacturing semiconductor package
  • Method for manufacturing semiconductor package
  • Method for manufacturing semiconductor package

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Embodiment Construction

[0022] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are provided to describe the present invention more completely to those skilled in the art. The following embodiments can be modified into various other forms, and the scope of the present invention is not limited to the following embodiments. In this case, in this specification, the terms of 'first', 'second', etc. are used to distinguish structural elements, and are not intended to reflect a certain order or degree of importance.

[0023] In the present invention, the injection molding process of the semiconductor package is performed using the release film coated with the electromagnetic wave shielding material in advance, and the electromagnetic wave shielding material is transferred to the surface of the resin sealing part at the same time as the injection molding, so that the shielding film can...

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Abstract

The present invention relates to a method of manufacturing a semiconductor package using a release film on which an electromagnetic wave shielding layer is formed. In the present invention, by using the release film on which the electromagnetic wave shielding layer is already applied, the process of forming the electromagnetic wave shielding layer, which is performed after the molding in the conventional semiconductor packaging process, is unnecessary, thereby simplifying the process and improving the productivity, and excellent electromagnetic wave shielding performance is also exhibited.

Description

technical field [0001] The present invention relates to a method of manufacturing a semiconductor package, and more particularly, to a method of manufacturing a novel semiconductor package in which electromagnetic wave shielding layer formation of the package is improved in a novel manner using a release film formed with an electromagnetic wave shielding layer structure, thereby reducing the number of processes and manufacturing costs. Background technique [0002] The interference effects of electromagnetic waves are increasing due to the increase in data transmission speed caused by the performance improvement of mobile devices. In order to solve the above-mentioned problems, a method of shielding electromagnetic waves by putting a metal can (Metal can) or the like on the electronic product is used. However, due to space constraints due to miniaturization and thinning of mobile devices, electromagnetic wave shielding methods at the level of semiconductor packages are incr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56
CPCH01L21/56H01L2224/48091H01L2224/48227H01L2224/97H01L2924/15311H01L2924/181H01L2924/00014H01L2924/00012H01L21/565H01L21/78H01L23/28H01L23/49816H01L23/60
Inventor 孙钟明
Owner BARUN ELECTRONICS CO LTD