Method for manufacturing semiconductor device
A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as high consumption, and achieve the effects of improving productivity, improving economy, and minimizing volume
Inactive Publication Date: 2019-07-05
BARUN ELECTRONICS CO LTD
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Problems solved by technology
Also, for cell sputtering, a polyimide (PI) tape is used as a jig attached to a ring frame (ring frame) to place a semiconductor package, but this consumes a relatively large material cost
At the same time, the throughput per hour (UPH) caused by the unit operation is only 10K level
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[0021] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are provided to fully explain the present invention to those skilled in the art, the following embodiments can be modified into various other forms, and the scope of the present invention is not limited to the following embodiments. In this case, in the present specification, terms such as "first", "second" and the like are used to distinguish structural elements, rather than showing an order or degree of importance.
[0022] Conventionally, in the case of manufacturing a semiconductor package using a substrate on which a plurality of semiconductor devices are mounted, in order to suppress the disturbance caused by electromagnetic waves, that is, in order to suppress electromagnetic interference (EMI), an electromagnetic wave shielding material is used after injection molding All surfaces of the inj...
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The invention relates to a method for manufacturing semiconductor device. The method comprises the steps of: a step of mounting a plurality of semiconductor devices on one surface of a substrate so asto be spaced apart from each other; a step of forming an injection molding portion by injection molding the plurality of semiconductor devices and an upper portion of the substrate; a step of forminga groove portion by performing a first dicing on an injection molded portion between the plurality of semiconductor devices; a step of filling the groove portion with a first electromagnetic wave shielding material to form an electromagnetic wave shielding filling portion; a step of attaching a surface protective film to the other surface of the substrate; a step of forming an electromagnetic wave shielding layer by applying a second electromagnetic wave shielding material to the surface of the injection molding part and the surface of the electromagnetic wave shielding filling part; a step of separating and removing the surface protective film from the other surface of the substrate; and a step of dividing the electromagnetic wave shielding filling portion and the substrate into semiconductor package units by performing a second dicing, wherein the step of attaching the surface protective film is performed before the step of forming the electromagnetic wave shielding layer.
Description
technical field [0001] The present invention relates to a method of manufacturing a semiconductor package, and more particularly, to a method of manufacturing a semiconductor package having a shielding unit that is highly resistant to electromagnetic wave interference in an environment where high frequencies are generated. Background technique [0002] The interference effect of electromagnetic waves is increasing due to the increase in data transmission speed caused by the improved performance of mobile devices. In order to solve the above-mentioned problems, a method of shielding electromagnetic waves by wrapping a metal can or the like in an electronic product is used. However, due to space constraints due to miniaturization and thinning of mobile devices, an electromagnetic wave shielding method at the semiconductor package level is increasingly required. [0003] As the electromagnetic wave shielding method at the level of the semiconductor package, there are a spray m...
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IPC IPC(8): H01L21/56H01L23/552
CPCH01L21/56H01L23/552H01L2224/97H01L2224/48227H01L2924/3025H01L2924/15311H01L2924/19107H01L2224/85H01L23/66H01L23/28H01L21/78H01L24/43
Inventor 孙钟明
Owner BARUN ELECTRONICS CO LTD